Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an adhesive layer on the top side of the structure. Aspects also include depositing a release layer and a glass layer on the top side of the structure. Aspects also include reducing a thickness of the silicon substrate on the bottom side of the structure.

A method is provided for protecting a MEMS unit, in particular a MEMS sensor, against infrared investigations, a surface patterning being performed for at least one first area of a surface of the MEMS unit, the first area absorbing, reflecting or diffusely scattering more than 50%, in particular more than 90% of an infrared light incident upon it.

Disclosed is a flexible electronic circuit substrate that includes a device that is fabricated from layers of the flexible electronic circuit substrate as part of construction of the flexible electronic circuit substrate. Such devices could be functional units such as micro electro mechanical devices (MEMS) devices such as micro-accelerometer sensor elements, micro flow sensors, micro pressure sensors, etc.

A force sensor having a noise shielding layer is disclosed. For a first embodiment, a top noise shielding layer is configured on a top surface of a force sensor to screen noise signals which are caused by human body's touch or approaching from top of the force sensor. For a second embodiment, a bottom noise shielding layer is configured on a bottom surface of the force sensor to screen noise signals which are caused by human body's touch or approaching from bottom of the force sensor.

The MEMS device has: a sensor body having a functional structure configured to transduce a physical or chemical quantity into a corresponding electrical quantity; and a cap bonded to the sensor body and having a first cavity overlying the functional structure. The cap has a supporting portion and a cover portion that form the first cavity. The supporting portion is bonded to the sensor body. The cover portion is bonded to the supporting portion and has an inner wall delimiting on a side the first cavity and facing the functional structure. The MEMS device further has a first coating that extends within the first cavity on the inner wall of the cover portion.

A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.

A process for the formation of a graphene membrane component includes arranging a graphene membrane in a relaxed condition of the graphene membrane on a surface of a supportive substrate. The graphene membrane extends across a cut-out with an opening at the surface of the supportive substrate. The graphene membrane is moreover arranged so that a first portion of the graphene membrane is arranged on the surface of the supportive substrate and a second portion of the graphene membrane is arranged over the opening of the cut-out. The process further includes tensioning of the second portion of the graphene membrane, in order to convert the second portion of the graphene membrane to a tensioned condition, so that the second portion of the graphene membrane is permanently in the tensioned condition in an operating temperature range of the graphene membrane component.

The invention concerns the production of segmented nanowires and components having said segmented nanowires. For the production of the nanowire structural element, a template based process is used preferably, wherein the electrochemical deposition of the nanowires in nanopores is carried out. In this manner, numerous nanowires are created in the template foil. For the electrochemical deposition of the nanowires, a reversed pulse procedure with an alternating sequence consisting of cathodic deposition pulses and anodic counter-pulses is carried out. By this means, segmented nanowires can be produced.

This application relates to the field of semiconductor technologies, and discloses a test structure and a manufacturing method therefor. Forms of the method may include: providing a top wafer structure, where the top wafer structure includes a top wafer and multiple first pads that are spaced from each other at a bottom of the top wafer; providing a bottom wafer structure, where the bottom wafer structure includes a bottom wafer and multiple second pads that are spaced from each other at a top of the bottom wafer, where a side surface of at least one of two adjacent second pads has an insulation layer; bonding the multiple first pads with the multiple second pads in a eutectic bonding manner, where each first pad is bonded with a second pad, to form multiple pads. This application may mitigate a problem that bonded pads are connected to each other.

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.