The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrangement has a micropump having a pump inlet and a pump outlet, the micropump being configured to suck in an analyte fluid present in the measuring cavity through the pump inlet and eject the same to an environment outside the measuring cavity via the pump outlet. Furthermore, the pump-sensor arrangement has a sensor for detecting at least one component of the analyte fluid present within the measuring cavity and movable by means of the micropump. In accordance with the invention, both the sensor and the micropump are commonly arranged on the first main surface of the substrate and within the measuring cavity.

An MEMS having a layered structure includes a cavity disposed in the layered structure and fluidically coupled to an external environment of the layered structure through at least one opening in the layered structure. The MEMS includes an interaction structure movably disposed in a first MEMS plane and in the cavity along a plane direction and configured to interact with a fluid in the cavity, wherein movement of the interaction structure is causally related to movement of the fluid through the at least one opening. The MEMS further includes an active structure disposed in a second MEMS perpendicular to the plane direction, the active structure mechanically coupled to the insulation structure and configured such that an electrical signal at an electrical contact of the active structure is causally related to a deformation of the active structure, wherein the deformation of the active structure is causally related to movement of the fluid.

A miniature gas detection system includes a separation flow channel fabricated by semiconductor processes and a filling material disposed in the main flow channel of the separation flow channel to perform adsorption and separation on compositions of compounds contained in the gas introduced into the main flow channel. Each detection flow channel is formed with a monitoring chamber, and a micro-electromechanical systems pump is formed on the bottom portion of the monitoring chamber. In each monitoring chamber, a light emitted from the light emitting element is reflected by the two mirrors and received by the light detection element. Therefore, the light detection elements obtain and output spectra of the compositions of compounds contained in the gas according to the differences in optical adsorptions of the compositions of compounds for lights with different wavelengths, so as to analyze and determine the type of the gas contained in the compositions of compounds.

A MEMS actuator includes a semiconductor body with a first surface defining a housing cavity facing the first surface and having a bottom surface, the semiconductor body further defining a fluidic channel in the semiconductor body with a first end across the bottom surface. A strainable structure extends into the housing cavity, is coupled to the semiconductor body at the bottom surface, and defines an internal space facing the first end of the fluidic channel and includes at least a first and a second internal subspace connected to each other and to the fluidic channel. When a fluid is pumped through the fluidic channel into the internal space, the first and second internal subspaces expand, thereby straining the strainable structure along the first axis and generating an actuation force exerted by the strainable structure along the first axis, in an opposite direction with respect to the housing cavity.

A planar micromechanical actuator suspended on opposing suspension zones including a neutral axis between the opposing suspension zones, first to fourth segments into which the planar micromechanical actuator is segmented between the opposing suspension zones, each including a first electrode and a second electrode which form a capacitor and are isolatedly affixed to each other at opposite ends of the respective segment along a direction between the opposing suspension zones so as to form a gap between the first and second electrode along a thickness direction, the gap being offset to the neutral axis along the thickness direction, and wherein the first to fourth segments are configured such that the planar micromechanical actuator deflects into the thickness direction by the first and fourth segment bending into the thickness direction and the second and third segments bending contrary to the thickness direction upon a voltage being applied to the first and second electrodes of the first to fourth segments.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

A micro-electro-mechanical system sensor device is disclosed. The sensor device comprises a micro-electro-mechanical system (MEMS) layer, comprising: an actuator layer and a cover layer, wherein a portion of the actuator layer is coupled to the cover layer via a dielectric; and an out-of-plane sense element interposed between the actuator layer and the cover layer, wherein the MEMS device layer is connected to a complementary metal-oxide-semiconductor (CMOS) substrate layer via a spring and an anchor.

A wearable display device includes a device body, a heat dissipation processing module, and an inflation actuation module. The device body includes a front cover, a side cover, a fillable gas bag, a circuit board, and a microprocessor. The heat dissipation processing module includes a first actuator corresponding to the microprocessor for performing heat exchange for the microprocessor. The inflation actuation module includes a base member, a gas communication channel, a second actuator, and a valve component. When the second actuator and the valve component are driven, the valve component is opened to control gas introduction of the second actuator, and the second actuator is actuated to transmit the gas to the gas communication channel for gas collection, and the second actuator further transmits the gas to the fillable gas bag for inflating the fillable gas bag, so as to allow a user to wear the wearable display device stably.

An MEMS includes a substrate having a cavity. The MEMS includes a movable layer arrangement arranged in the cavity including a first beam, a second beam and a third beam that is arranged between the first beam and the second beam and that is fixed at discrete areas electrically insulated from the same. The movable layer arrangement is configured to perform a movement along a direction of movement in a substrate plane in response to an electrical potential between a first beam and a third beam or in response to an electrical potential between the second beam and the third beam. The first, second and third beams are part of a first layer of the movable layer arrangement. The movable layer arrangement includes a second layer arranged adjacent to the first layer along a direction perpendicular to the substrate plane. The second layer is arranged movably along the direction of movement.

A MEMS device includes a layer stack having a plurality of MEMS layers arranged along a layer stack direction. The MEMS device includes a movable element formed in a first MEMS layer and arranged between a second MEMS layer and a third MEMS layer of the layer stack. A driving unit is further provided, comprising a first drive structure mechanically firmly connected to the movable element and a second drive structure mechanically firmly connected to the second MEMS layer. The driving unit is configured to generate on the movable member a drive force perpendicular to the layer stack direction, and the drive force is configured to deflect the movable member.