A micro-electro-mechanical systems (MEMS) includes a flexible membrane that creates a suction force by flexing to permit manipulation of a microscale object. The MEMS element includes a casing structure; a flexible membrane attached to the casing structure; and an electrode structure, wherein a voltage applied to the electrode structure causes the flexible membrane to flex relative to the casing structure. The flexible membrane and the casing structure define a gap into which the flexible membrane may flex, and a foot extending from the flexible membrane in a direction away from the casing structure, wherein the foot and the flexible membrane define a clearance region on an opposite side of the flexible membrane from the gap. When the MEMS element interacts with an object to be manipulated the foot spaces the membrane apart from the object, and flexing of the membrane generates the suction force for manipulating the object.

Aspects are directed to a MEMS device configurable to receive signals from a first, a second, a third, and a fourth signal source operating at a first, a second, a third, and a fourth frequency, respectively. The MEMS device may be configured to combine the first signal with the second signal generating a first combined signal, and to combine the third signal with the fourth signal generating a second combined signal. The first combined signal may be coupled to the first terminal of the MEMS device while the second combined signal may be coupled to the second terminal of the MEMS device. The first common terminal may be configured to produce an output associated with the second and fourth frequencies. The MEMS device may be further configured to derive from the produced output a signal indicative of nonlinearities or of changes in capacitance related to the MEMS device.

Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate with a top device surface and a bottom device surface having a MEMS component in a device region. A top device bond ring is disposed on the top device surface surrounding the device region and a bottom device bond ring is disposed on the bottom device surface surrounding the device region. A top cap with a top cap bond ring is bonded to the top device bond ring by a top eutectic bond and a bottom cap with a bottom cap bond ring is bonded to the bottom device bond ring by a bottom eutectic bond. The eutectic bonds encapsulate the MEMS device.

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate with a top device surface and a bottom device surface having a MEMS component in a device region. A top device bond ring is disposed on the top device surface surrounding the device region and a bottom device bond ring is disposed on the bottom device surface surrounding the device region. A top cap with a top cap bond ring is bonded to the top device bond ring by a top eutectic bond and a bottom cap with a bottom cap bond ring is bonded to the bottom device bond ring by a bottom eutectic bond. The eutectic bonds encapsulate the MEMS device.

The invention provides a micromechanical device comprising a support structure and a deflecting element connected to the support structure, wherein the deflecting element comprises at least one deformable member adapted to deform extensionally, flexurally or torsionally with respect to a deformation axis for allowing deflection of the deflecting element with respect to the support structure. Further, there are means for statically deflecting the deflecting element or detecting the magnitude of static deflection of the deflecting element. According to the invention, the deformable member is made of silicon doped with an n-type doping agent to a doping concentration of at least 1.1*10.sup.20 cm.sup.3. The invention allows for manufacturing micromechanical devices whose mechanical operation is not affected by prevailing temperature conditions.

An electrostatic actuator having a stationary electrode and a fixedly cantilevered bender is described, wherein the bender includes a cantilever electrode disposed opposite to the stationary electrode in an overlapping area and being deflectable in the direction of the stationary electrode.

Systems and techniques are provided for transducer array subdicing. A laminate material may include two laminate material flexures which each have a flexure boundary defined by a gap in the piece of laminate material. A trench may be located between the two flexures. The trench may be defined by a removal of a portion of laminate material from the piece of laminate material. A second trench may be on an opposite surface of the piece of laminate material from the trench. The second trench may be partially aligned with the trench. The trench and the second trench may result from the removal of laminate material from the piece of laminate material to a depth of 20% to 60% of the thickness of the piece of laminate material.

An optical module includes a semiconductor substrate, an electrostatic actuator including a fixed portion fixed to the semiconductor substrate and a movable portion moved with respect to the fixed portion by an electrostatic force generated between the movable portion and the fixed portion, a first spring portion connected to the movable portion and having a first spring constant K1, a second spring portion connected between the first spring portion and the semiconductor substrate and having a second spring constant K2 greater than the first spring constant K1, and a movable mirror which is an optical component connected to a connection portion between the first spring portion and the second spring portion.

A process for manufacturing an interaction system of a microelectromechanical type for a storage medium, the interaction system provided with a supporting element and an interaction element carried by the supporting element, envisages the steps of: providing a wafer of semiconductor material having a substrate with a first type of conductivity and a top surface; forming a first interaction region having a second type of conductivity, opposite to the first type of conductivity, in a surface portion of the substrate in the proximity of the top surface; and carrying out an electrochemical etch of the substrate starting from the top surface, the etching being selective with respect to the second type of conductivity, so as to remove the surface portion of the substrate and separate the first interaction region from the substrate, thus forming the supporting element.