The present invention discloses a liquid-driven nano-porous actuator and the application thereof, and belongs to the field of nano material actuators. According to the present invention, by changing the content of the liquid in the nano-porous material, the interface between the surface liquid of the nano-porous material and air is exchanged between flat and curved states, so as to change the compressive stress acting on the nano-porous material from the surface tension of the liquid and change the elastic deformation of the nano-porous material, thus driving the nano-porous material to contract and expand in a reversible manner and further realizing driving performance. The actuator features simple and easy implementation and environmental-friendly effect without the need of external physical excitation signals (light, magnetic field, electricity or heat), complicated external excitation process, conversion of electric, magnetic, and light energy, chemical or electrochemical process, or toxic, harmful or corrosive chemical substances, and it is especially suitable for bio-robot, medical and aerospace fields.

A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

A method for manufacturing a component in a substrate including: a) modifying a structure of at least one region of the substrate to make the at least one region more selective; and b) chemically etching the at least one region to selectively manufacture the component.

A method of fabricating a microelectromechanical systems (MEMS) array includes forming a plurality of mirror structures on a first side of a substrate. The plurality of mirror structures includes a plurality of first mirror structures having a first resonant frequency and a plurality of second mirror structures having a second resonant frequency different from the first resonant frequency.

A MEMS device is provided with an actuator stator providing an electrical connection point. The MEMS device includes an electrical distribution substrate, and an actuator stator positioned above it. The actuator stator has a floor and an outer frame extending up from the floor. The MEMS device includes a stator pad disposed on the outer frame and above the electrical distribution substrate. The MEMS device also includes an actuator rotor suspended above the floor, within the outer frame, with a sensor mounted thereon. A wire bond interconnect electrically couples the sensor to the stator pad. In some embodiments, the outer frame includes a via extending therethrough which electrically connects the stator pad with the electrical distribution substrate, enabling an electrical connection between the sensor and the electrical distribution substrate. In some embodiments, a second wire bond interconnect electrically connects the stator pad and the substrate.

Disclosed herein are energy harvesting devices and sensors, and methods of making and use thereof. The energy harvesting devices can comprise a membrane disposed on a substrate, wherein the membrane comprises a two-dimensional (2D) material and one or more ripples; and a component electrically, magnetically, and/or mechanically coupled to the membrane and/or the substrate, such that the component is configured to harvest energy from the membrane. The sensors can comprise a membrane disposed on a substrate, wherein the membrane comprises a two-dimensional material one or more ripples; and a component electrically, magnetically, and/or mechanically coupled to the membrane and/or the substrate, such that the component is configured to detect a signal from the membrane.

A microelectromechanical device comprising a mechanical structure extending along a longitudinal direction, linked to a planar substrate by an anchorage situated at one of its ends and able to flex in a plane parallel to the substrate, the mechanical structure comprises a joining portion, which links it to each anchorage and includes a resistive region exhibiting a first and second zone for injecting an electric current to form a resistive transducer, the resistive region extending in the longitudinal direction from an anchorage and arranged so a flexion of the mechanical structure in the plane parallel to the substrate induces a non-zero average strain in the resistive region and vice versa; wherein: the first injection zone is carried by the anchorage; and the second injection zone is carried by a conducting element not fixed to the substrate and extending in a direction, termed lateral, substantially perpendicular to the longitudinal direction.

An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and at least one device within the build-up carrier disposed in an area void of a layer of patterned conductive material. A method and an apparatus including a computing device including a package including a microprocessor are also disclosed.

A method for producing micromechanical components is provided. A liquid starting material which can be cured by means of irradiation is applied onto a substrate. A partial volume of the starting material is cured by means of a local irradiation process using a first radiation source in order to produce at least one three-dimensional structure. The three-dimensional structure delimits at least one closed cavity in which at least one part of the liquid starting material is enclosed. Alternatively or in addition, a micromechanical component is provided that contains a liquid starting material, which is partly cured by means of irradiation, and at least one cavity in which the liquid starting material is enclosed.

An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die; and at least one device within the build-up carrier disposed in an area void of a layer of patterned conductive material. A method and an apparatus including a computing device including a package including a microprocessor are also disclosed.