An actuator device includes: a support portion; a movable portion; a first connection portion connecting the movable portion to the support portion on a first axis so that the movable portion is swingable around the first axis; and a first wiring provided on the first connection portion. The first wiring includes a first main body formed of a metal material having a Vickers hardness of 50 HV or more. The first main body includes a first surface facing the first connection portion and a second surface other than the first surface. The second surface has a shape in which a curvature is continuous over the entire second surface in a cross-section perpendicular to an extension direction of the first wiring.

A micromechanical component includes an adjustable part, a mounting, at least one bending actuator, and a permanent magnet. The part is positioned on the mounting so as to be adjustable relative to the mounting about a first rotation axis and about a second rotation axis inclined relative to the first axis. The actuator includes at least one movable subregion. Movement of the subregion results in a restoring force that moves the part about the first axis. The part is connected indirectly to the magnet to be adjustable about the second axis of rotation via a magnetic field built up by the magnet together with a yoke device of the component or an external yoke. A micromirror device includes the micromechanical component. A method for adjusting the part includes adjusting the part simultaneously about the first and the second axes.

To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.

A MEMS chip package is provided with a removable cover to allow non-destructive testing. The MEMS package has a container (with walls and a bottom) and a cover. The cover has a glass pane, and is secured to the MEMS package with an elastomeric gasket mounted between the walls of the MEMS package and the cover. A number of attachment mechanisms secure the cover to the MEMS package.

An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.

Wavefront reversal device using a MEMS spatial phase modulator integrated with a retroreflector array. A cat's eye retro reflector array is integrated with a phase only MEMS spatial light modulator (SLM) so that each cat's eye retro-reflector in the array is integrated into each pixel of the MEMS SLM. The composite MEMS device provides continuous analog phase modulation and retro-reflection for each pixel. By integrating a cat's retro-reflector onto each pixel, the combination provides both phase-shifting control and tilt compensation of piecewise optical beams, on a pixel-by-pixel basis. The resultant device emulates a deformable mirror with an integrated cat's eye retro array, the combination of which is equivalent to a true wave front reversal device.

An optical electronics device includes first, second and third wafers. The first wafer has a semiconductor substrate with a dielectric layer on a side of the semiconductor substrate. The second wafer has a transparent substrate with an anti-reflective coating on a side of the transparent substrate. The first wafer is bonded to the second wafer at a silicon dioxide layer between the semiconductor substrate and the anti-reflective coating. The first and second wafers include a cavity extending from the dielectric layer through the semiconductor substrate and through the silicon dioxide layer to the anti-reflective coating. The third wafer includes micromechanical elements. The third wafer is bonded to the dielectric layer, and the micromechanical elements are contained within the cavity.

The present disclosure is directed to compact packaging for optical MEMS devices, such as one- and two-dimensional beam scanners. An embodiment in accordance with the present disclosure includes a light source and a MEMS-based scanning element for steering at least a portion of the light provided by the light source in at least one dimension as an output light signal, as well as one or more optical elements for collimating and/or redirecting light within a sealed chamber defined by the elements of a housing. In some embodiments, the one or more optical elements include a reflective lens that collimates the light provided by the light source while simultaneously correcting phase-front error imparted by the scanning element while steering the output beam.

An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.

A light reflecting element includes a support part 21, a hinge part 30, and a light reflecting part 40, in which the light reflecting part 40 includes a support layer and a light reflecting layer 50, the hinge part 30 includes a torsion bar portion 31, extending portions 34A and 34B extending from sides of the torsion bar portion 31, and movable pieces 35A and 35B extending from ends of the extending portions 34A and 34B, an end of the torsion bar portion 31 is fixed to the support part 21, the hinge part 30 is capable of being twisted and deformed around an axis of the torsion bar portion 31, the support layer is fixed to the movable pieces 35A and 35B, a recess 41D is provided at least in a portion of the support layer facing a space 35D located between the first movable piece 35A and the second movable piece 35B, and a stress adjusting layer 91 is provided on the support layer in parallel to the light reflecting layer 50 and separated from the light reflecting layer 50.