An electro-optic device includes an interconnection board provided with an internal terminal, and a chip mounted on the interconnection board, and the chip is provided with a mirror, a drive element, and a chip-side terminal electrically connected to the drive element. The interconnection board includes a first surface on which an internal terminal is disposed, a second surface located on an opposite side to the first surface, a third surface connecting the first surface and the second surface to each other, and a fourth surface located on an opposite side to the third surface. The interconnection board is provided with a metal member exposed on the first surface and the second surface, and through holes (a first through hole and a second through hole) extending from the third surface to the fourth surface and having contact with the metal member.

An optical reflecting device includes a mirror part, a pair of joints, a pair of vibration parts, a plurality of driving parts, and a fixed part. Each of the joints has a first end connected to respective one the facing positions to each other on the mirror part and a second end opposite to the first end, and extends along a first axis. Each of the vibration parts has a central portion connected to the second end of respective one of the joints. A plurality of driving parts is disposed in each of the pair of vibration parts, and rotates the mirror part. Both ends of each of the pair of vibration parts are connected to the fixed part. The beam width defined as the length of each of the joints in a direction orthogonal to the first axis is greater than the beam width of each of the pair of vibration parts.

A method for manufacturing a device having a three-dimensional magnetic structure includes applying or introducing magnetic particles onto or into a carrier element. A plurality of at least partly interconnected cavities are formed between the magnetic particles, which contact one another at points of contact, by coating the arrangement of magnetic particles and the carrier. The cavities are penetrated at least partly by the layer generated when coating, resulting in the three-dimensional magnetic structure. A conductor loop arrangement is provided on the carrier or a further carrier. When a current flows through the conductor loop, an inductance of the conductor loop is changed by the three-dimensional magnetic structure, or a force acts on the three-dimensional magnetic structure or the conductor loop by a magnetic field caused by the current flow, or when the position of the three-dimensional magnetic structure is changed, a current flow is induced through the conductor loop.

Embodiments of the application provide a MEMS chip and an electrical packaging method for a MEMS chip. The MEMS chip includes a MEMS device layer, a first isolating layer located under the MEMS device layer, and a first conducting layer located under the first isolating layer. At the first isolating layer, there are a corresponding quantity of first conductive through holes in locations corresponding to conductive structures in a first region and in locations corresponding to electrodes in a second region. At the first conducting layer, there are M electrodes spaced apart from one another, and the M electrodes are respectively connected to M of the first conductive through holes. At the first conducting layer, electrodes in locations corresponding to at least some of the conductive structures in the first region are electrically connected in a one-to-one correspondence to electrodes in locations corresponding to at least some of the electrodes in the second region.

A micromechanical assembly having a holder, a drive frame which has at least one energizable coil device disposed at least one of on and in the drive frame and which is joined to the holder via at least one frame spring, a mirror element that is at least partially framed by the drive frame and is suspended from the drive frame by a first mirror spring and a second mirror spring, the mirror element being disposed between the two mirror springs and being adjustable about a mirror axis of rotation in relation to the drive frame, and the mirror element being suspended from the drive frame asymmetrically relative to the mirror axis of rotation. A method for manufacturing a micromechanical assembly is also described. A method for operating a micromechanical assembly is also described.

A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

The underlying invention presents a device which connects a vibratably suspended optical element to at least two actuators mounted fixedly on one side via curved spring elements, wherein the actuators are implemented to cause the vibratably suspended optical element to vibrate via the curved spring elements. Both the actuators and the entire system may be implemented to be more robust and be operated more reliably due to the curved shaping of the spring elements.

An image display apparatus includes a light source device including a light source unit; a scanning optical system including an image forming unit on which an intermediate image is formed by light from the light source unit; and a virtual image optical system configured to guide light of the intermediate image by using a reflecting mirror and a curved transmissive reflection member. The scanning optical system includes an optical scanning unit configured to scan the light from the light source unit in a main scanning direction and a sub-scanning direction of the image forming unit. The image forming unit is a transmissive member curved with a convex surface toward the reflecting mirror.

A torsion bar portion is of a meandering shape including a plurality of straight sections and a plurality of turnover sections. The plurality of straight sections extends in a first direction along a swing axis and is juxtaposed in a second direction intersecting with the first direction. The plurality of turnover sections alternately couples two ends of the straight sections. Wiring is disposed on the torsion bar portion. The wiring includes first wiring sections and second wiring sections. The first wiring sections include damascene wiring sections that are disposed so as to be embedded in grooves formed in the turnover sections and that are made of a first metal material including Cu. The second wiring sections are disposed on the straight sections and are made of a second metal material more resistant to plastic deformation than the first metal material.