An actuator device includes a support part, a first movable part, and a second movable part. The second movable part includes a pair of first connection portions positioned on both sides of the first movable part on a first axis and connected to a pair of first connecting parts, and a pair of second connection portions positioned on both sides of the first movable part on a second axis and connected to a pair of second connecting parts. Each of the second connection portions includes a portion having a width larger than a width of a portion of the second movable part other than the first and second connection portions. An inner edge of each of the second connection portions, includes a depression recessed in a second axis direction, and an outer edge of each of the pair of second connection portions, includes a protrusion protruding in the second axis direction.

A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

A displacement increasing mechanism has a fixing portion, first and second actuators coupled to the fixing portion, a first beam having first and second end portions and coupled to the first actuator at the first end portion, a second beam having third and fourth end portions and coupled to the second actuator at the third end portion, and a drive target member coupled to a parallel arrangement portion at which the first and second beams are arranged in parallel with each other. The first actuator is driven to pull the first beam from a second end portion side in the direction of extending the first beam, and the second actuator is driven to push the second beam form a fourth end portion side in the direction of extending the second beam.

A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

A chip package for optical sensing includes a substrate, and a semiconductor device positioned on the substrate and coupled to the substrate through a first conducting element. Two molding processes are applied, to form a first colloid body on the substrate so as to cover the semiconductor device and, on the first colloid body, to form a second colloid body which covers an optical device. The optical device is electrically connected to the substrate through a second conducting element. The light transmittance of the second colloid body exceeds that of the first colloid body.

The present disclosure provides a displacement amplification structure and a method for controlling displacement. In one aspect, the displacement amplification structure of the present disclosure includes a first beam and a second beam substantially parallel to the first beam, an end of the first beam coupled to a fixture site, and an end of the second beam coupled to a motion actuator; and a motion shutter coupled to an opposing end of the first and second beams. In response to a displacement of the motion actuator along an axis direction of the second beam, the motion shutter displaces a distance along a transversal direction substantially perpendicular to the axis direction.

An optical circuit switch device and method for using the device are provided. The device may include a fiber array including a set of optical fibers configured for transmitting optical signals. The device may include a collimator array coupled to the fiber array configured for aligning the optical signals received from the fiber array. The device may include a first mirror array for receiving the optical signals from the collimator array. The device may include a second mirror array for receiving the optical signals from the first mirror array. The device may include a lens located at the fiber array, the lens having a focal point at the second mirror array.

An all-solid state optical transmit/receive terminal includes binary optical switches to steer an optical beam, without mechanical components, phased array of emitters/collectors or large number of phase shifters. A lens optically couples a surface array of emitters/collectors to free space, giving each emitter/collector a respective direction in free space. The emitters/collectors are also coupled, via an H-tree or other branched optical waveguide network, to a common input/output port, and from there to a receiver and/or transmitter. The binary optical switches are disposed at optical junctions of the optical waveguide network. ON switches pass an optical signal through the optical waveguide network, between the common input/output port and one or more selected emitter/collectors, thereby selecting a free space direction(s). Only a relatively small subset of the binary optical switches needs to be ON, therefore powered, simultaneously at any given time.