The present invention relates to a process and apparatus for the preparation of a bonded substrate. More particularly, the present invention relates to a PDMS bonding apparatus. More specifically, the present invention relates to a PDMS bonding apparatus which uses plasma to bond PDMS to a substrate.

The present invention discloses a PDMS bonding apparatus and process for using said apparatus, the apparatus comprising: a process chamber (100) forming a sealed processing space (S) for bonding of PDMS (polydimethylsiloxane); a first support (200) installed in the process chamber (100) and which supports the PDMS (1); a second support (300) installed in the process chamber (100) opposing the first support (200) and which supports a bonding object (2) which is bonded to the PDMS (1); a gas injection unit (400) which ejects process gas between the first support (200) and the second support (300), and; a plasma generator (500) which creates a plasma atmosphere within the process chamber (100).

A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

A fluidic chip comprising: a sealing layer having an upper surface and a lower surface; and a formed part comprising a generally planar body having a lower surface sealed with the upper surface of the sealing layer, the generally planar body having a number of through holes and a number of wells in fluid communication with the number of through holes, wherein together with the upper surface of the sealing layer, the number of through holes and the number of wells respectively define a number of fluid inlets and a number of fluid chambers in fluid connection with each other in the fluidic chip.

A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.

The present disclosure is drawn to microfluidic devices. The microfluidic device includes a microfluidic well, a layered composite stack, and an optical sensor. The layered composite stack includes an optical filter composited with an etch-stopping layer. The optical filter defines the microfluidic well. The optical sensor is associated with the microfluidic well and has the optical filter positioned therebetween.

The invention relates to a microelectromechanical system (MEMS) component or microfluidic component comprising a free-hanging or free-standing microchannel (1), as well as methods for manufacturing such a microchannel, as well as a flow sensor, e.g. a thermal flow sensor or a Coriolis flow sensor, pressure sensor or multi-parameter sensor, valve, pump or microheater, comprising such a microelectromechanical system component or microfluidic component. The MEMS component allows to increase the flow range and/or decrease the pressure drop of for instance a micro Coriolis mass flow meter by increasing the channel diameter, while maintaining its advantages.

The invention relates to a method of fabricating a micro machined channel, comprising the steps of providing a substrate of a first material and having a buried layer of a different material therein, and forming at least two trenches in said substrate by removing at least part of said substrate. Said trenches are provided at a distance from each other and at least partly extend substantially parallel to each other, as well as towards said buried layer. The method comprises the step of forming at least two filled trenches by providing a second material different from said first material and filling said at least two trenches with at least said second material; forming an elongated cavity in between said filled trenches by removing at least part of said substrate extending between said filled trenches; and forming an enclosed channel by providing a layer of material in said cavity and enclosing said cavity.

A fluidic chip includes at least one nanochannel array, the nanochannel array including a surface having a nanofluidic area formed in the material of the surface; a microfluidic area on said surface; a gradient interface area having a gradual elevation of height linking the microfluidic area and the nanofluidic area; and a sample reservoir capable of receiving a fluid in fluid communication with the microfluidic area. In another embodiment, a fluidic chip includes at least one nanochannel array, the nanochannel array includes a surface having a nanofluidic area formed in the material of the surface; a microfluidic area on said surface; and a gradient interface area linking the microfluidic area and the nanofluidic area, where the gradient interface area comprises a plurality of gradient structures, and the lateral spacing distance between said gradient structures decreases towards said nanofluidic area; and a sample reservoir capable of receiving a fluid in fluid communication with the microfluidic area.

A method for coating one or more channels of a sample using a vapor deposition includes alternatingly supplying at least two gaseous precursor to one or more channels defined in a sample through at least one feed line that is connected to a first channel end of the one or more channels. An adjustable pressure gradient is generated and conducts the at least two gaseous precursors along a first flow direction (SR1) from the at least one feed line to a first discharge line through the one or more channels. The at least two gaseous precursor and reaction products are discharged from the one or more channels through a first discharge line that is connected to a second channel end of the one or more channels of the sample. Non-reacted precursors and reaction products are discharged through a second discharge line that is connected to the first channel end.

A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.