Provided is a micro electro-mechanical system (MEMS) sensor including a substrate including a first cavity, a first frame including a second cavity at least partially overlapping the first cavity, at least a portion of the first frame being spaced apart from the substrate, a plurality of resonators, each of the plurality of resonators including a first end connected to the first frame and a second end extending into the second cavity, and a second frame including a first region connected to the first frame and a second region spaced apart from the first frame and connected to the substrate.

A MEMs and/or NEMs measurement system includes a resonant assembly comprising: an input and an output, a plurality of N optical resonators Ri indexed i each having a resonance wavelength λr,i, at least one waveguide to which the optical resonators are coupled, at least one element coupled to each resonator Ri, an emission device, a modulation device, an injection device configured to superpose the N light beams to form an input beam and to inject the beam as input to the resonant assembly, at least one detector configured to detect a light beam arising from the beam at the output of the resonant assembly and to generate an output signal, a demodulation device comprising at least N synchronous-detection demodulation modules.

A micromechanical arm is provided. The micromechanical arm includes: a bottom metal piece having a plurality of trenches extending downwardly from a top surface of the bottom metal piece; an intermediate layer on the bottom metal piece and filling at least a portion of each of the plurality of trenches; and a top metal piece on the intermediate layer. The intermediate layer is made of a material that has a stiffness smaller than the bottom metal piece and the top metal piece.

A light deflector includes: a conductor layer formed as an integral layer on an SOI oxide film layer; a piezoelectric element having an upper electrode, a piezoelectric film, and a conductor layer serving as a lower electrode; an interlayer insulating film covering the conductor layer and the piezoelectric element from the surface side; a plurality of wirings formed on the surface of the interlayer insulating film in such a manner as to extend in the region of the surface of the interlayer insulating film under which the conductor layer exists; and a ground electrode connected to the conductor layer.

According to one embodiment, a sensor includes a base body, a first supporter fixed to the base body, and a first movable part separated from the base body. The first movable part includes a first movable base part supported by the first supporter, a second movable base part connected with the first movable base part, and a first movable beam. The first movable beam includes a first beam, a first movable conductive part, and a first connection region. The first beam includes a first beam portion, a second beam portion, and a third beam portion between the first beam portion and the second beam portion. The first beam portion is connected with the first movable base part. The second beam portion is connected with the second movable base part. The first connection region connects the third beam portion and the first movable conductive part.

A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

A free-standing microstructure may be formed from an engineered substrate including a first silicon layer, a second silicon layer, and an intermediate layer. The second silicon layer may include a monocrystalline silicon film. The intermediate layer may be between the first silicon layer and the second silicon layer. The intermediate layer may include a silicon- or germanium-based material having a different lattice constant than the first silicon layer or the second silicon layer. The intermediate layer of the free-standing microstructure may further include one or more voids wherein at least a portion of the silicon- or germanium-based material is absent between the first silicon layer and the second silicon layer.

The invention relates to a microelectromechanical drive for moving an object, having electrostatic bending actuators, wherein each electrostatic bending actuator has a cantilever having at least one active element which has a layer stack forming at least one capacitor positioned offset to a center-of-gravity-plane of the cantilever which leads alongside a longitudinal axis of the cantilever from a supported end of the cantilever to a loose end, which is averted from the supported end of the cantilever and which has a contact area for engaging with the object.

The microelectromechanical drive can be used to displace any target objects from nanoscopic to macroscopic sizes that are within the force-displacement configurations of the electrostatic bending actuators. The microelectromechanical drive is suited to act as an inchworm drive.

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.

A micro scanning mirror, including a fixed substrate, a lens, and multiple cantilevers, are provided. Each cantilever includes a piezoelectric material structure, multiple first drive electrodes, and multiple second drive electrodes. The piezoelectric material structure includes a connecting part, a folding part, and a fixed part. The connecting part connects the lens along a direction parallel to a central axis of the lens. The folding part has a bending region and multiple drive electrode regions. The fixed part is connected to the fixed substrate, and the folding part is connected to the connecting part and the fixed part. The first drive electrodes and the second drive electrodes are respectively located in the corresponding drive electrode regions in the folding part. The micro scanning mirror of the disclosure can drive a large-sized micro mirror to rotate at an appropriate rotation angle.