The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.

A bulk acoustic wave resonator apparatus includes a resonator member, at least one anchor structure coupling the resonator member to a substrate, and a comb-drive element connected to the resonator member. The comb-drive element includes first comb fingers protruding from the resonator member, and second comb fingers of a different material than the first comb fingers interdigitated with the first comb fingers to define sub-micron capacitive gaps therebetween. Respective sidewalls of the first comb fingers are oppositely-tapered relative to respective sidewalls of the second comb fingers along respective lengths thereof, such that operation of the comb-drive element varies the sub-micron capacitive gaps at the respective sidewalls thereof. Respective tuning electrodes, which are slanted at respective angles parallel to an angle of respective sidewalls of the resonator member, may also be provided for quadrature tuning between different resonance modes of the resonator member. Related devices and fabrication methods are also discussed.

A physical quantity sensor includes a substrate, a support portion fixed to the substrate, a movable body which is displaceable in a first direction with respect to the support portion and has a movable electrode provided therein, and a fixed electrode fixed to the substrate. The fixed electrode includes first and second fixed electrode fingers positioned on one side of the support portion, third and fourth fixed electrode fingers positioned on the other side thereof. The movable electrode includes first to fourth movable electrode fingers which face the first to fourth fixed electrode fingers in the first direction, respectively.

According to one embodiment, a sensor includes a base body, a first structure body, and a second structure body. The first structure body includes a first fixed portion, a first conductive portion, and first electrodes. The first fixed portion is fixed to the base body. The first conductive portion is held by the first fixed portion. The first conductive portion is separated from the base body in a first direction. The first electrodes are held by the first conductive portion. A distance between the base body and the first electrodes is changeable. The second structure body includes a second conductive portion and second electrodes. The second conductive portion is fixed to the base body. The second electrodes are held by the second conductive portion. One of the second electrodes is between the one of the first electrodes and the other one of the first electrodes.

A method of manufacturing a MEMS vibration element having a fixed electrode, a movable electrode, and an elastic supporting unit that elastically supports the movable electrode with respect to the fixed electrode includes: etching a base material having a first thickness to form the fixed electrode and the movable electrode; and etching the base material to form the elastic supporting unit having a second thickness, the second thickness being less than the first thickness.

A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.

A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

An optical device includes: a base that includes a main surface; a movable unit that includes an optical function unit; and an elastic support unit that is connected between the base and the movable unit, and supports the movable unit so that the movable unit is movable along a first direction perpendicular to the main surface. The elastic support unit includes a lever, a first torsion support portion that extends along a second direction perpendicular to the first direction and is connected between the lever and the movable unit, and a second torsion support portion that extends along the second direction and is connected between the lever and the base. A torsional spring constant of the first torsion support portion is greater than a torsional spring constant of the second torsion support portion.

A scanning assembly for an optical instrument includes a reflector and a folded-beam spring assembly coupled to the reflector for deflecting the reflector for beam scanning. A lever suspension assembly is coupled to the folded-beam spring assembly and provides torsional movement of the reflector for beam scanning over a two-dimensional region, allowing for large total scan angles and large vertical displacements.

A MEMS capacitive microphone according to the present invention is configured such that a support plate 120 from which an inside thereof has been removed in a plane is attached to supports 110 each having an end fixed to a substrate 100, an anchor 130 is attached to an edge region of the support plate 120, an edge of a diaphragm 200 is supported by the anchor 130, and a “substrate-free area” includes the anchor 130 in a plan view, and pluralities of moving comb fingers 300 and stiffeners are attached to a top or bottom or a top and bottom of the diaphragm 200, and the supports 110 support the stationary comb fingers 400 arranged at predetermined intervals on both sides of the moving comb fingers 300 in a plan view.