The present invention relates to a MEMS-based three-axis acceleration sensor and, more specifically, comprises: an x-axis sensor mass sensing an external acceleration inputted in the direction of a first axis parallel to a bottom wafer substrate; a y-axis sensor mass sensing an external acceleration inputted in the direction of a second axis parallel to the bottom wafer substrate and perpendicular to the first axis; and a z-axis sensor mass formed so as to encompass the x-axis sensor mass and the y-axis sensor mass and sensing an external acceleration inputted in the direction of a third axis perpendicular to the bottom wafer substrate, wherein space is saved and accelerations in the three axis directions are respectively measured by sensing the independent movement of each axis sensor mass.

A method for forming a MEMS device may include performing a silicon-on-nothing process to form a cavity in a monocrystalline silicon substrate at a first depth relative to a top surface of the monocrystalline silicon substrate; forming, in an electrically conductive electrode region of the monocrystalline silicon substrate, an electrically insulated region extending to a second depth that is less than the first depth relative to the top surface of the monocrystalline silicon substrate; and etching the monocrystalline silicon substrate to expose a gap between a first electrode and a second electrode, wherein the second electrode is separated from the first electrode, within a first depth region, by a first distance defined by the electrically insulated region and the gap, and wherein the second electrode is separated from the first electrode, within a second depth region, by a second distance defined by the gap.

A MEMS sensor has a proof mass, a sense electrode, and a shield. At least a portion of the proof mass and shield may form a capacitor that causes an offset movement of the proof mass. A series of test values may be provided in order to minimize the offset movement or compensate for the offset movement. In some embodiments, the shield voltage may be modified to reduce the offset movement. Residual offsets due to other factors may also be determined and utilized for compensation to reduce an offset error in a sensed signal.

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis, a first wiring which is provided on the connection portion, a second wiring which is provided on the support portion, and an insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one of the first wiring and the second wiring and covers a corner of the first connection part. The rigidity of a first metal material forming the first wiring is higher than the rigidity of a second metal material forming the second wiring. The other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening.

A method includes holding a mask using an electrostatic chuck. The mask includes a substrate having a first bump and a second bump separated from the first bump and a patterned layer. The first bump and the second bump face the electrostatic chuck. The substrate is between the patterned layer and the electrostatic chuck. The first bump and the second bump are spaced apart from the patterned layer. The first bump and the second bump are ring strips in a top view, and the first bump has a rectangular cross section and the second bump has a triangular cross section. The method further includes generating extreme ultraviolet (EUV) radiation using an EUV light source; and directing the EUV radiation toward the mask, such that the EUV radiation is reflected by the mask.

A thermal metamaterial device comprises at least one MEMS thermal switch, including a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus.

Provided is an acceleration sensor, including a base; a first anchor point fixed to a middle part of the base; an inner side mass unit surrounding an outer side of the first anchor point, an outer side mass unit surrounding an outer side of the inner side mass unit, a first seesaw unit and a second seesaw unit arranged opposite to each other to define an annular structure surrounding an outer side of the outer side mass unit, a first acceleration detection unit and a second acceleration detection unit. Part of the first acceleration detection unit is arranged at the annular structure to detect acceleration in an out-of-plane Z-axis direction, the second acceleration detection unit is arranged at the outer side mass unit to detect acceleration in an in-plane X-axis direction and in an in-plane Y-axis direction. A design thereof is reasonable and the sensitivity is high.

A teeter-totter type accelerometer includes one or more platforms configured so as to move in proportion to deformation of the substrate and/or anchor(s). The platform(s) may be in a fixed position relative to the substrate, e.g., by being fixedly attached to the anchor(s) or by being fixedly attached to the substrate, or the platform(s) may be movable relative to the substrate, e.g., by being tethered to the anchor(s) so as to allow the platform(s) to pivot relative to the anchor(s). Electrodes are placed on the substrate underlying the platform(s) for sensing position of the platform(s) relative to the underlying substrate. The teeter-totter proof mass is configured such that it can rotate relative to the platform(s), e.g., by being tethered to the platform(s) or by being tethered to one or more anchors separate from the platform(s). The output of the accelerometer is adjusted based on signals from these platform-sensing electrodes in order to reduce or eliminate offset drift.

A physical quantity sensor includes a base substrate; a movable unit which is provided so as to be displaced with respect to the base substrate by facing the base substrate; a first fixed electrode and a second fixed electrode which are disposed on the base substrate by facing the movable unit; and a plurality of protrusion portions which are disposed at a position overlapped with the movable unit in a planar view, on the movable unit side of the base substrate, in which the protrusion portion includes a conductive layer with the same potential as that of the first fixed electrode and the second fixed electrode, and an insulating layer which is provided on a side opposite to the base substrate with respect to the conductive layer.

A mirror device includes a fixing section, mirror section, first connecting section, first beam section, second connecting section, and second beam section. The mirror section includes a major surface and a light reflecting surface. The first connecting section includes a first end connected to the mirror section and extends in a first direction from the first end. The first beam section connects the fixing section and the first connecting section and extends intersecting the first direction. The first beam section can be deformed by applying voltage. The second connecting section includes a second end connected to the first beam section and extends in the first direction from the second end on a virtual straight line extending in the first direction from the first end. The second beam section connects the fixing section and the second connecting section and extends intersecting the first direction, and can be deformed by applying voltage.