An acoustic device includes a substrate including a first surface and a second surface facing a side opposite to the first surface, an opening, an acoustic MEMS element fixed to the first surface to cover the opening, an annular electrode surrounding the opening on the second surface, and a solder resist layer covering the second surface adjacently to the annular electrode on an outer side and an inner side of the annular electrode The solder resist layer includes a first cutaway portion to connect a first portion and a second portion to each other, the first portion being any portion in an edge of the annular electrode the second portion being any portion in an edge of the substrate.

The present application relates to multifunctional hierarchically microstructured surfaces and three-dimensional anchored interfacial domain structures. The multifunctional properties are extremal. In one aspect the microstructured surfaces may be super-adhesive. Examples of super-adhesive mechanisms may include gas trapping, fluid trapping, and solid wrinkle trapping. In another aspect the micro structured surfaces may be nearly adhesive-less. Examples of adhesive-less mechanisms may include inter-solid surface lubrication, energy conserving fluid flows, and super-low drag phase-phase lateral displacement. The extremal structures may be obtained by anchoring mechanisms. Examples of anchoring mechanisms may include Wenzel-Cassie formation, contact angle confusion, and capillary effects.

Provided are monolithic structures comprising one or more suspended, nanoporous membranes that are in contact with one or more fluidic cavities, methods of making same, and exemplary uses of same. The monolithic structures can be formed using a transmembrane etch. The monolithic structures can be used, as examples, as filters and filtration modules in microfluidic devices, dialysis devices, and concentration devices in laboratory, industrial, and medical processes.

A MEMS sensor includes a bond portion in which a metal structure in a device substrate and a metal laminate are eutectically bonded. The bond portion bonds the device substrate and a lid substrate. The metal laminate is located on a main surface of the lid substrate and facing an exposed portion in the metal structure. The metal laminate includes a first metal and a second metal different from the first metal.

A micro electromechanical system (MEMS) includes a substrate, a semiconductor device and a protection wall. The substrate has a surface. The semiconductor device is disposed on the surface. The protection wall has a poly-silicon layer surrounding the semiconductor device and connecting to the surface.

A directional microelectromechanical systems (MEMS) microphone, including a first layer, a second layer, and a third layer stacked in sequence and multiple adhesive members formed between the first layer, the second layer, and the third layer, is provided. The adhesive members include an outer adhesive member disposed surrounding a periphery of the first layer, the second layer, and the third layer and an inner adhesive member disposed within a range surrounded by the outer adhesive member. The outer adhesive member and the inner adhesive member form at least two slits between the first layer, the second layer, and the third layer. An external sound is transmitted to a sound sensing element after passing through two receiving holes of the directional MEMS microphone respectively along two paths. One of the two paths passes through the at least two slits.

A microfluidic device includes: a base plate allowing an electromagnetic wave to pass therethrough and having no autofluorescence; a microwell array formed on the base plate and including a wall layer in which a plurality of through-holes are formed in a thickness direction; and a lid member disposed opposite to the base plate in a state of being separated from the wall layer, wherein microwells are formed by the base plate and the through-holes formed in the wall layer, and wherein the wall layer is formed of a material containing a colored component that absorbs an electromagnetic wave of a predetermined wavelength.

A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

A system includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, and the second membrane comprises a plurality of openings, a sealed low pressure chamber between the first membrane and the third membrane, and a plurality of electrodes in the sealed low pressure chamber.

A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.