A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

A MEMS switch, a preparation method thereof, and an electronic apparatus. The MEMS switch includes: a substrate, a coplanar waveguide line structure disposed on a side of the substrate, an isolation structure disposed on a side of the coplanar waveguide line structure away from the substrate, a film bridge disposed on a side of the isolation structure away from the substrate. The coplanar waveguide line structure includes a first wire, a first DC bias line, a second wire, a second DC bias line and a third wire arranged at intervals sequentially. The second wire is one of an RF signal transmission line and a ground line, the first wire and the third wire are the other of the RF signal transmission line and the ground line. The film bridge is crossed between the first wire and third wire, and is connected with the first wire and the third wire respectively.

A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process, a layer of first material is deposited on a wafer comprising a plurality of pits a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits; using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, and etching the exposed parts of the first layer using the third layer as a protective layer.

A MEMS pressure transducer includes a semiconductor body, a lower dielectric region arranged above the semiconductor body, and a fixed electrode region and a lower anchoring region, which are formed by conductive material, are arranged on the lower dielectric region and are laterally separated from each other. A membrane of conductive material is suspended above the fixed electrode region so as to delimit a cavity upwardly, the fixed electrode region facing the cavity, the membrane being deformable as a function of pressure and forming a variable capacitor together with the fixed electrode region. An upper anchoring region of conductive material laterally delimits the cavity and is interposed, in direct contact, between the membrane and the lower anchoring region.

A method is provided that includes forming a first metal layer of a seal structure over a micro-electromechanical system (MEMS) structure and over a channel formed through the MEMS structure to an integrated circuit of a semiconductor structure. The first metal layer is formed at a first temperature. The method includes forming a second metal layer over the first metal layer. The second metal layer is formed at a second temperature less than the first temperature. The method includes performing a first cooling process to cool the semiconductor structure.

A MEMS actuator assembly package features a number of drop test resistant mechanisms is disclosed. These mechanisms are used to decelerate and finally stops the heavy load of the image sensor attached to the MEMS actuators along all six directions of the in-plane and out-of-plane axes (x, y, z). The MEMS actuator assembly package comprises first and second sets of flexible stoppers attached to the MEMS actuator along with a set of hard stoppers that engage in a sequential manner with the moving mass of the loaded actuator to decelerate it, bringing it to a complete stop when exposed to mechanical shock along the four directions of the in-plane axes (x and y). When the assembly package is exposed along the positive and negative direction of the z-axis, the moving mass is stopped by features built in the package.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) device in which a slit at a movable mass of the MEMS device has a top notch slit profile. The MEMS device may, for example, be a speaker, an actuator, or the like. The slit extends through the movable mass, from top to bottom, and has a width that is uniform, or substantially uniform, from the bottom of the movable mass to proximate the top of movable mass. Further, in accordance with the top notch slit profile, top corner portions of the MEMS substrate in the slit are notched, such that a width of the slit bulges at the top of the movable mass. The top notch slit profile may, for example, increase the process window for removing an adhesive from the slit while forming the MEMS device.

A microfluidic chip and a fabrication method of the microfluidic chip are provided. The microfluidic chip includes an array substrate, and a hydrophobic layer disposed on a side of the array substrate. The hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate. The microfluidic chip also includes at least one hydrophilic structure. A hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole.

The invention discloses a MEMS microphone, which includes a case with an accommodating cavity and an acoustic vent arranged on the case, a housing with an empty cavity as well as MEMS and ASIC chips with a back cavity are arranged inside the accommodating cavity. The housing is installed on the case, the MEMS chips are installed in the housing, the housing is arranged with a through hole connecting the empty cavity and the back cavity. The housing is also arranged with a vent hole. The MEMS microphone also includes a membrane flap arranged on the housing and used to close the vent hole. The membrane flap changes its shape under airflow effects and opens the vent hole. The MEMS microphone of this invention can avoid the diaphragm of the MEMS chips being damaged by airflow impact.

The present invention is notably directed to a method of fabrication of a microfluidic chip (1), comprising: providing (S10-S20) a wafer (10, 12) of semiconductor material having a diamond cubic crystal structure, exhibiting two opposite main surfaces (S1, S2), one on each side of the wafer, and having, each, a normal in the <100> or <110> direction; and performing (S30) self-limited, anisotropic wet etching steps on each of the two main surfaces on each side of the wafer, to create a via (20, 20a) extending transversely through the thickness of the wafer, at a location such that the resulting via connects an in-plane microchannel (31) on a first one (S1) of the two main surfaces to a second one (S2) of the two main surfaces, the via exhibiting slanted sidewalls (20s) as a result of the self-limited wet etching. The invention further concerns microfluidic chips accordingly obtained.