A method of providing a MEMS device including a through-hole in a layer of structural material using a multitude of MEMS method steps. A versatile method to create a through-hole, in particular a multitude thereof, involves a step of exposing a polymeric layer of positive photoresist in a direction from the outer surface of the positive photoresist to light resulting in an exposed layer of positive photoresist including relatively strongly depolymerized positive photoresist in the top section of a recess while leaving relatively less strongly depolymerized positive photoresist in the bottom section of the recess.

A method for manufacturing an opening structure is provided. The method may include: forming a patterned mask over a first side of a carrier; forming material over the first side of the carrier covering at least a portion of the carrier; forming a first opening in the carrier from a second side of the carrier opposite the first side of the carrier to at least partially expose a surface of the patterned mask; and forming a second opening in the material from the second side of the carrier using the patterned mask as a mask.

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.

Disclosed herein is a MEMS sensor package that includes a substrate, an annular-shaped first dry film pattern stuck to one surface of the substrate, and a MEMS sensor chip including a tubular support and a detection part which is supported on the support so as to overlap a cavity of the support. The MEMS sensor chip is fixed to the substrate by sticking an annular mounting surface of the support to the first dry film pattern.

A membrane is formed through processes including depositing a first piezoelectrical layer, depositing a first electrode layer over the first piezoelectrical layer, patterning the first electrode layer to form a first electrode, depositing a second piezoelectrical layer over the first electrode, depositing a second electrode layer over the second piezoelectrical layer, patterning the second electrode layer to form a second electrode, and depositing a third piezoelectrical layer over the second electrode. The third piezoelectrical layer, the second piezoelectrical layer, and the first piezoelectrical layer are etched to form a through-hole. The through-hole is laterally spaced apart from the first electrode and the second electrode. A first contact plug and a second contact plug are then formed to electrically connect to the first electrode and the second electrode, respectively.