A MEMS accelerometer includes a proof mass that rotates about an in-plane axis in response to a linear acceleration such that a portion of the proof mass moves out of plane along an out-of-plane axis in a direction of a bump stop. When the proof mass becomes stuck to the bump stop, a signal is applied to one or more anti-stiction electrodes in a manner that moves the proof mass along a movement axis in order to release the proof mass from the bump stop.

A device may include a device layer, wherein a vertical direction is perpendicular to a surface of the device layer, a movable structure in the device layer, wherein a first rotation axis extends through the movable structure and lies in the device layer, an electrostatic in-plane force transducer, which comprises one or more first transducer structure on a first side from the first rotation axis, and one or more second transducer structure on a second side from the first rotation axis, and a first translation spring, which extends from the movable structure to the electrostatic in-plane force transducer on the first side from the first rotation axis, and a second translation spring which extends from the movable structure to the electrostatic in-plane force transducer on the second side from the first rotation axis, and wherein the first translation spring and the second translation spring are in the device layer.

A coupling device (130) for coupling a plurality of vibration systems (110, 120), which are mounted above a substrate (200) in such a manner that said systems can vibrate along a first direction (x) and are offset with respect to one another in a second direction (y) perpendicular to the first direction (x), has a flexural beam spring (135) which can bend in the first direction (x) and can be connected to the vibration systems (110, 120); in this case, connections (112, 122) between the flexural beam springs (135) and the vibration systems (110, 120) are arranged between at least two connection points (140) of the flexural beam springs (135) to the substrate (200) in such a manner that a deflection of the flexural beam springs (135) which is caused by movements of the vibration systems (110, 120) results in a vibration of the flexural beam springs (135) with antinodes of vibration in the region of the connections (112, 122) between the flexural beam springs (135) and the vibration systems (110, 120).

A MEMS element according to the present invention is provided with a base, an insulation layer fixed to one surface of the base, a first upper layer at least portions of which are fixed to the insulation layer, and a second upper layer provided surrounding the first upper layer and disposed being separated from the first upper layer by slits, wherein the first upper layer includes, at predetermined portions, protruding portions protruding toward the second upper layer, and the protruding portions are fixed to the insulation layer.

A microelectromechanical accelerometer is provided that includes one or more proof masses. The accelerometer also includes four sets of stator combs that form a set of four measurement capacitors together with rotor combs. Some rotor combs have a positive offset in a direction in the device plane in relation to stator, while others have a negative offset. Some rotor combs have a negative offset in a direction perpendicular to the device plane in relation to stator combs. Moreover, some stator combs have a negative offset in the direction perpendicular to the device plane in relation to rotor combs.

A MEMS module includes: a first MEMS element and a second MEMS element each including a movable portion which is a portion of a substrate including a hollow portion formed therein, the movable portion configured to warp in shape according to an air pressure difference between an internal air pressure inside the hollow portion and an external air pressure outside the hollow portion; and an electronic component configured to calculate a change in external air pressure outside the substrate by using an amount of warpage of the movable portion of at least one of the first MEMS element and the second MEMS element, wherein the amount of warpage of the movable portion according to the external air pressure differs between the first MEMS element and the second MEMS element.

A microelectromechanical device is provided that includes a mobile mass element, a fixed structure adjacent to the mass element and a motion limiter that includes a first stopper element and a second stopper element. The motion limiter is configured to resist further movement of the main body of the mass element toward the fixed structure with a first spring constant when a first threshold has been crossed but a second threshold has not yet been crossed. The motion limiter is also configured to resist further movement of the main body of the mass element toward the fixed structure with a second spring constant after a second threshold has been crossed.

A microelectromechanical device is provided that includes a first proof mass and a second proof mass. A first coupling structure is configured to transmit force in a primary direction between the first and second proof masses. The first coupling structure is connected to a primary spring structure in a first suspension structure that extends from a first anchor point to the first proof mass. The first primary spring structure is more flexible in the primary direction than in the y-direction.

A micro-electromechanical gyroscope includes a supporting body and a sensor assembly. The sensor assembly includes a transduction mass, constrained to the supporting body for oscillation along a first driving axis perpendicular to the supporting body and along a sensing axis perpendicular to the first driving axis, driving structures each having an actuator, and a driving mass and motion conversion flexures connecting the driving mass to the transduction mass. The actuator causes the driving mass to oscillate along a second driving axis perpendicular to the first driving axis and the sensing axis. The motion conversion flexures cause movements of the transduction mass along the first driving axis in response to movements of the driving mass along the second driving axis. Sensing structures are mechanically coupled to the transduction mass and have a variable capacitance depending on a position of the transduction mass along the sensing axis.

An MEMS comprising a substrate having a cavity includes a movable layer arrangement arranged in the cavity including a first beam, a second beam and a third beam that is arranged between the first beam and the second beam and that is fixed at discrete areas electrically insulated from the same. The movable layer arrangement is configured to perform a movement along a direction of movement in a substrate plane in response to an electrical potential between a first beam and a third beam or in response to an electrical potential between the second beam and the third beam. The first, second, and third beams are part of a first layer of the movable layer arrangement. The movable layer arrangement includes a second layer arranged adjacent to the first layer along a direction perpendicular to the substrate plane. The second layer is arranged movably along the direction of movement.