A microdevice (100) comprising a movable element (111) capable of moving relative to a fixed part (115), produced in first and second layers of material (104, 106) arranged one above the other such that the movable element comprises a portion (112) of the first layer and a portion (118) of the second layer secured to each other, and wherein the movable element is suspended from the fixed part by a suspension structure (121) formed in the first and/or second layer of material.

A MEMS includes a substrate having a cavity, and a moveable element arranged in the cavity, the moveable element including a first electrode, a second electrode and a third electrode that is arranged between the first electrode and the second electrode and is fixed in an electrically insulated manner from the same at discrete areas. The moveable element is configured to perform a movement along a movement direction in a substrate plan in response to an electric potential between the first electrode and the third electrode or in response to an electric potential between the second electrode and the third electrode. A dimension of the third electrode perpendicular to the substrate plane is lower than a dimension of the first electrode and a dimension of the second electrode perpendicular to the substrate plane.

An MEMS includes a substrate having a cavity. The MEMS includes a movable layer arrangement arranged in the cavity including a first beam, a second beam and a third beam that is arranged between the first beam and the second beam and that is fixed at discrete areas electrically insulated from the same. The movable layer arrangement is configured to perform a movement along a direction of movement in a substrate plane in response to an electrical potential between a first beam and a third beam or in response to an electrical potential between the second beam and the third beam. The first, second and third beams are part of a first layer of the movable layer arrangement. The movable layer arrangement includes a second layer arranged adjacent to the first layer along a direction perpendicular to the substrate plane. The second layer is arranged movably along the direction of movement.

A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes ventilation holes, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a coverage structure disposed on the sidewall of at least one ventilation hole.

Microelectronic structure comprising at least one movable mass that is mechanically connected to a first mechanical element by a first mechanically linking connector and to a second mechanical element (24) by electrically conductive second mechanically linking connector, and a device for electrically biasing the second mechanically linking connector, the second mechanically linking connector being such that they are the seat of a thermo-piezoresistive effect, the second linking connector and the movable mass being placed with respect to each other so that a movement of the movable mass applies a mechanical stress to the second linking connector, wherein the electrically biasing device are DC voltage biasing device and form, with at least the second mechanically linking connector, a thermo-piezoresistive feedback electric circuit.

A device includes a substrate, a first electrode formed on the substrate and a structural layer formed on the substrate. The structural layer includes a movable mass and a fixed portion, the movable mass being suspended above the substrate and the first electrode being interposed between the substrate and the movable mass. A second electrode is spaced apart from an upper surface of the movable mass by a gap and an anchor couples the second electrode to the fixed portion of the structural layer. A method entails integrating formation of the second electrode into a wafer process flow in which the first electrode and the structural layer are formed.

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

A flexure based guidance system for precision motion control includes a base that is fixed in position, a carriage that can move relative to the base, an actuator provides the force to move the carriage relative to the base, and one or more flexures arrays that each comprise two or more leaf flexure elements. The actuator causes the carriage to move relative to the base, which causes the flexure elements in the flexure array to flex. The leaf flexure elements are thin, compliant and deform, bend, or deflect in a deterministic manner when mechanically stressed. In some embodiments, stiffeners can be added to the flexures. The guidance system can be integrated into a varifocal head mounted display (HMD) to adjust a location of one or moveable elements in an optical system of the HMD to control a location of an image plane.

A micro-electrical-mechanical system (MEMS) actuator includes a first set of actuation fingers, a second set of actuation fingers, and a first spanning structure configured to couple at least two fingers of the first set of actuation fingers while spanning at least one finger of the second set of actuation fingers.

A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.