A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.

The present invention discloses an MEMS pressure sensing element, including a substrate provided with a groove; a pressure-sensitive film disposed above the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity; and a movable electrode plate and a fixed electrode plate which are located in the sealed cavity and form a capacitor structure, wherein the fixed electrode plate is fixed on a bottom wall of the groove of the substrate, and the movable electrode plate is suspended above the fixed electrode plate and opposite to the fixed electrode plate; and the pressure-sensitive film is connected to the movable electrode plate so as to drive the movable electrode plate to move under the action of an external pressure. According to the MEMS pressure sensing element, pressure sensitivity and electrical detection are separated, the pressure-sensitive film is exposed in air, the capacitor structures are disposed in the sealed cavity defined by the pressure-sensitive film and the substrate, and the movable electrode plates of the capacitor structures can be driven by the pressure-sensitive film. In this way, not only is a pressure-sensitive function finished, but also external electromagnetic interferences on the capacitor structures are shielded.

A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; a MEMS module including a diaphragm suspended in the inner cavity, a light flap is formed in the diaphragm, when an acoustic pressure is applied, an aperture is formed by opening of the light flap, and a size of the aperture increases or decreases with a magnitude of the acoustic pressure applied; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, and a light beam passes through the aperture to the sensor; and an integrated circuit module electrically connected with the optoelectronic module. Advantages of high sensitivity and flat frequency response are realized.

An MEMS optical microphone, including a casing including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, an aperture is provided penetrating through the diaphragm, and a size of the aperture increases or decreases with acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the aperture, and a size of the light beam is larger than a maximum size of the aperture; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Dynamic range of the MEMS optical microphone is improved, wider range of sound signals can be sensed, and higher sensitivity can be realized.

A method includes producing a semiconductor wafer. The semiconductor wafer includes a plurality of microelectromechanical system (MEMS) semiconductor chips, wherein the MEMS semiconductor chips have MEMS structures arranged at a first main surface of the semiconductor wafer, a first semiconductor material layer arranged at the first main surface, and a second semiconductor material layer arranged under the first semiconductor material layer, wherein a doping of the first semiconductor material layer is greater than a doping of the second semiconductor material layer. The method further includes removing the first semiconductor material layer in a region between adjacent MEMS semiconductor chips. The method further includes applying a stealth dicing process from the first main surface of the semiconductor wafer and between the adjacent MEMS semiconductor chips.

There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.

A compliant structure including a frame and a shuttle distant from the frame mounted on a cantilever that is supported by the frame. The cantilever and shuttle together are movable transversely to and out of a plane of the frame. The structure also includes one or more flexures that connect the cantilever with the frame. The cantilever includes a body at least in part extending in a first direction which points to the shuttle. The one or more flexures connect to the shuttle and/or to the cantilever in the vicinity of the shuttle. The flexures are oriented in a second direction, which second direction is generally transverse with respect to the first direction.

The present invention provides a motion control structure and a actuator. The motion control structure includes a motion platform, a first actuator having a first execution unit arranged on opposite sides of the motion platform along an X-axis direction and a second execution unit arranged on opposite sides of the motion platform along a Y-axis direction. The first execution unit includes a first actuating element displaced along the X-axis direction. The second execution unit includes a second actuating element displaced along the Y-axis direction. A second actuator surrounds an inner periphery of the motion platform and includes a third execution unit having an assembly portion displaced along the Z-axis direction. The motion control structure of the invention has the advantages that the motion platform can be driven to realize motion in six degrees of freedom.