The MEMS actuator is formed by a body, which surrounds a cavity and by a deformable structure, which is suspended on the cavity and is formed by a movable portion and by a plurality of deformable elements. The deformable elements are arranged consecutively to each other, connect the movable portion to the body and are each subject to a deformation. The MEMS actuator further comprises at least one plurality of actuation structures, which are supported by the deformable elements and are configured to cause a translation of the movable portion greater than the deformation of each deformable element. The actuation structures each have a respective first piezoelectric region.

A micromechanical component including a mounting including a spanned diaphragm, which is warpable via a pressure difference between a first diaphragm side and a second diaphragm side against a diaphragm counter force according to a diaphragm spring constant of the diaphragm, and at least one actuator electrode, which is connected to the diaphragm and adjustable against a spring force according to at least one spring constant of at least one spring with the aid of a warping of the diaphragm, an overall system spring constant being definable as the sum of a diaphragm spring constant of the diaphragm and the spring constant of the single spring, or an overall spring constant of all springs, via which the at least one actuator electrode is connected to the mounting, and the spring constant of the single spring or of all springs being at least 5% of the overall system spring constant.

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator.

An air pulse generating element, disposed in a sound producing device, includes a membrane, disposed within a chamber; and a plurality of valves, disposed by the membrane within the chamber, configured to seal a plurality of openings of the chamber in response to a plurality of valve control signals; wherein the membrane and the plurality of valves are all fabricated at a first layer.

A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the second surface. The MEMS also includes a backplate comprising a plurality of voids. Each of the plurality of fingers extends into a respective one of the plurality of voids. The MEMS further includes an insulator between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.

An MENS microphone is provided in the present disclosure. The MENS microphone includes a fixing pole plate, a vibrating pole plate, an elastic arm; the fixing pole plate comprises a first fixing electrode, an insulating layer, a second fixing electrode that are superimposed sequentially, a through hole penetrating through the first fixing pole plate, the insulating layer and the second fixing pole plate; the vibrating pole plate is embedded in the through hole, comprises a main body and a plurality of spaced protrusions provided on two opposite side walls of the main body; the fixing pole plate comprises a plurality of spaced grooves recessed from two opposite inner walls of the fixing pole plate respectively toward corresponding outer walls, the grooves penetrates through the first fixing electrode, the insulating layer, the second fixing electrode; the protrusions are inserted into the grooves and correspond to the grooves one to one.

A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.

A micromechanical z-acceleration sensor. The sensor has a substrate with a main extension plane, and a micromechanical rocker which is arranged parallel to the extension plane above the substrate and can be tilted in a first direction z perpendicular to the extension plane, wherein the rocker in a first partial region: has first perforations, which extend through the rocker in the first direction z, with a first cross-section parallel to the main extension plane with a first aspect ratio of at least 1:1; and has second perforations, which extend through the rocker in the first direction z, with a second cross-section with a second aspect ratio of a longer side to a shorter side, wherein the first aspect ratio is smaller than the second aspect ratio. A first perforation and a second perforation are arranged alternately next to one another in a repeating pattern.

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator; wherein the in-plane MEMS actuator includes an electromagnetic actuator portion.

To provide a contact point structure of an electronic device capable of maintaining stable impact resistance. There is provided a contact point structure including: a base portion that is a semiconductor substrate; a movable contact point portion that is supported by the base portion and is a part of a movable member capable of being driven in a predetermined direction; and a fixed contact point portion that faces the movable contact point portion. The fixed contact point portion includes a fixed portion that is supported by the base portion and an extending member that extends from the fixed portion and is capable of being displaced relative to the fixed portion.