Patent classifications
B81B2203/053
Force sensor and manufacture method thereof
A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.
MEMS sound transducer, MEMS microphone and method for providing a MEMS sound transducer
An MEMS sound transducer comprises a first and a second backplate, as well as a diaphragm, which is arranged between the first and the second backplate and is held by an edge fastening between the first and the second backplate. The MEMS sound transducer comprises a clamping structure, which is configured to provide fixing for the diaphragm when an electrostatic force acting in an operating state is applied between the first and the second backplate and at a distance from the edge fastening, and to release the fixing in absence of the electrostatic force.
FORCE SENSOR AND MANUFACTURE METHOD THEREOF
A force sensor comprises a first substrate, a second substrate, a third substrate, and a package body. The first substrate includes a fixed electrode, at least one first conductive contact, and at least one second conductive contact. The second substrate is disposed on the first substrate and electrically connected to the first conductive contact of the first substrate. The second substrate includes a micro-electro-mechanical system (MEMS) element corresponding to the fixed electrode. The third substrate is disposed on the second substrate and includes a pillar connected to the MEMS element. The package body covers the third substrate. The foregoing force sensor has better reliability.
Electric connection flexures
Electric connection flexures for moving stages of microelectromechanical systems (MEMS) devices are disclosed. The disclosed flexures may provide an electrical and mechanical connection between a fixed frame and a moving frame, and are flexible in the moving frame's plane of motion. In implementations, the flexures are formed using a process that embeds the two ends of each flexure in the fixed frame and moving frame, respectively.
Flexure-based, tip-tilt-piston actuation micro-array
A flexure-based micro-array having a plurality of micro-assemblies, each comprising: an object; and at least three electrostatic actuation modules for tipping, tilting, and/or piston-actuating the object, each actuation module comprising: a base with first and second electrodes electrically isolated from each other; an electrically conductive lever arm; a first flexure bearing suspending the lever arm adjacent the first and second electrodes so that electrical activation of at least one of the first and second electrodes produces an electrostatic moment of force on the lever arm to resiliently bias the first flexure bearing and pivot the lever arm about a fulcrum; and a second flexure bearing connecting the lever arm to the object at a connection location that is different from other connection locations of the other actuation modules so that pivoting the lever arm about the fulcrum induces the second flexure bearing to pivot the object about an object pivot axis defined between two of the other connection locations while the second flexure bearing decouples the lever arm from object displacements induced by two of the other actuation modules connected to the two other connection locations defining the object pivot axis, wherein the plurality of micro-assemblies are arranged with the objects juxtaposed in a substantially 2D array.
MEMS acoustic transducer with combfingered electrodes and corresponding manufacturing process
A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.
MEMS device
The disclosure provides a MEMS device including: a fixed substrate having a cavity; a driving unit disposed in the cavity and floating above the fixed substrate; and an elastic unit for physically connecting the fixed substrate with the driving unit and varying the height of the driving unit according to a control current, wherein the elastic unit includes a bimorph driving unit connected to the fixed substrate and bent according to the control current, a spring connected to the driving unit, and a frame connecting the bimorph driving unit to the spring. Therefore, in order to overcome the limitations according to the power consumption and the size-reduction due to a coil and a magnet, the MEMS device drives one lens and thus can reduce the power consumption and the size thereof.
MEMS actuator element and MEMS actuator array with a plurality of MEMS actuator elements
A MEMS (micro-electromechanical system) actuator element includes a substrate, a stationary first electrode structure with an edge structure, a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electrostatically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into an intermediate position between a minimum and maximum vertical deflection position, wherein the minimum and maximum deflection position specify a maximum deflection path, wherein the edge structures of the first and second electrode structures are to each other and are vertically spaced apart in the minimum deflection position and wherein, in the maximum deflection position, the vertical immersion path of the edge structure of the second electrode structure into the edge structure of the first electrode structure is up to 0.5 times the maximum deflection path z.sub.S.
MEMS Device for Interaction with Fluids
A fluidic microelectromechanical system (MEMS) device includes fluid interaction elements (FIEs) that can be displaced by an actuator to generate fluid flow. The FIEs include a serial arrangement of cantilevered lever arms to achieve, for example, high sound pressure levels in a micro speaker or high pump rates in a micropump as compared to some conventional MEMS devices.
Low Voltage Electrostatic MEMS Actuators for Large Angle Tip, Tilt, and Piston Beamsteering
An actuator element of a MEMS device on a substrate able to create large, out-of-plane deflection includes two separated metallic layers contacting the substrate. The second metallic layer has a first portion contacting the substrate and a second portion having cantilevered over the substrate and first metallic layer. A first insulating layer contacts the cantilevered metallic layer on a bottom contacting surface and a second insulating layer contacting the cantilevered metallic layer on a portion of a top contacting surface. The second, cantilevered portion of the metallic layer is prestressed causing the distal end to deform away from the substrate. Applying a voltage potential between the first and second metallic layers creates an electrostatic field drawing the distal end toward the substrate.