Patent classifications
B81B2203/055
Sensor package having a movable sensor
A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.
Miniature kinetic energy harvester for generating electrical energy from mechanical vibrations
The invention relates to a miniature kinetic energy harvester for generating electrical energy, comprising a support, a first element having walls surrounding at least one cavity, at least one spring mounted between the first element and the support, the spring being arranged so that the first element may be brought into oscillation relative to the support according to at least one direction of oscillation, a transducer arranged between the first element and the support for converting oscillation of the first element relative to the support into an electrical signal, at least one second element housed within the cavity and mounted to freely move within the cavity relative to the first element so as to impact the walls of the cavity when the harvester is subjected to vibrations.
MEMS, METHOD OF MANUFACTURING AN MEMS AND METHOD OF CONFIGURING AN MEMS
An MEMS has a substrate and a cavity arranged in the substrate. A movable element is arranged in the cavity, configured to interact with a fluid arranged in the cavity, wherein a movement of the fluid and a movement of the movable element are causally related. A first opening which connects the cavity to an environment of the substrate causes a first phase offset of a first periodic oscillation which is causally related to the movement of the movable element when passing through the first opening. A second opening which connects the cavity to the environment of the substrate causes a second phase offset, different from the first phase offset, of a second periodic oscillation which is causally related to the movement of the movable element when passing through the second opening.
Micro-opto-mechanical system sensor, arrangement and manufacturing method
There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.
MICROELECTROMECHANICAL SENSOR DEVICE WITH ACTIVE OFFSET COMPENSATION
A microelectromechanical sensor device having a sensing structure with: a substrate; an inertial mass, suspended above the substrate and elastically coupled to a rotor anchoring structure by elastic coupling elements, to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes, integrally coupled to the inertial mass to be movable due to the inertial movement; and second sensing electrodes, fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes are arranged in a suspended manner above the substrate and a compensation structure is configured to move the second sensing electrodes with respect to the first sensing electrodes and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure.
MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT
A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
SENSOR PACKAGE HAVING A MOVABLE SENSOR
A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.
Miniature hermetic acceleration detection device
A MEMS acceleration detection device including a housing having a cavity and a spring mass system assembled into the cavity of the housing. A lid enclosing the spring mass system in the cavity and contacting a top surface of the housing.
MEMS sensor compensation for off-axis movement
A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.
Manufacturing method of sensor package
A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.