A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

A physical quantity sensor includes a substrate, an element assembly, a fixed portion fixed to the substrate, a movable member that is displaced with respect to the fixed portion, a beam connecting the fixed portion and the movable member, and a structure that is fixed to the substrate. The structure has a first structure in which the first structure and the movable member are arranged in a first direction with a first gap therebetween, and a second structure in which the second structure and the movable member are arranged in a second direction orthogonal to the first and a third direction with a second gap larger than the first gap therebetween. A spring constant of the beam when the movable member is displaced around an axis along a third direction is smaller than a spring constant of the beam when the movable member is displaced in the first direction.

A physical quantity sensor includes a substrate, an element assembly having a movable member that is displaced relative to the substrate, a beam connecting the fixed portion and the movable member, and a structure fixed to the substrate. The structure has first and second structures. The first structure and the movable member are arranged in a first direction and are separated by a first gap. The second structure and the movable member are arranged in a second direction orthogonal to the first and third direction, and are separated by a second gap smaller than the first gap. A spring constant of the beam when the movable member is displaced around an axis is smaller than a spring constant of the beam when the movable member is displaced in the first direction.

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator; wherein the in-plane MEMS actuator includes an electromagnetic actuator portion.

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

A droplet control and detection device and an operating method thereof are provided. The droplet control and detection device includes: a light source; a first electrode; a second electrode; a droplet arranged on a light-exiting side of the light source, where the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode; a photoelectric detection structure configured to detect light emitted by the light source and reflected by the droplet; and a processing circuit configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information.

A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

A physical quantity sensor includes a sensor element (acceleration sensor element) and a substrate (package) to which the sensor element is attached using a bonding material (resin adhesive), in which, when an elastic modulus of the bonding material is e, 2.0 GPa<e<7.8 GPa is satisfied.