Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

The present invention relates to a MEMS-based three-axis acceleration sensor and, more specifically, comprises: an x-axis sensor mass sensing an external acceleration inputted in the direction of a first axis parallel to a bottom wafer substrate; a y-axis sensor mass sensing an external acceleration inputted in the direction of a second axis parallel to the bottom wafer substrate and perpendicular to the first axis; and a z-axis sensor mass formed so as to encompass the x-axis sensor mass and the y-axis sensor mass and sensing an external acceleration inputted in the direction of a third axis perpendicular to the bottom wafer substrate, wherein space is saved and accelerations in the three axis directions are respectively measured by sensing the independent movement of each axis sensor mass.

Three-axis monolithic microelectromechanical system (MEMS) accelerometers and methods for fabricating integrated capacitive and piezo accelerometers are provided. In an embodiment, a three-axis MEMS accelerometer includes a first sensing structure for sensing acceleration in a first direction. Further, the three-axis MEMS accelerometer includes a second sensing structure for sensing acceleration in a second direction perpendicular to the first direction. Also, the three-axis MEMS accelerometer includes a third sensing structure for sensing acceleration in a third direction perpendicular to the first direction and perpendicular to the second direction. At least one sensing structure is a capacitive structure and at least one sensing structure is a piezo structure.

A flexure includes a support first end connected to a first frame; a support second end connected to a second frame; and a buckled section connecting the first support end to the second support end. The length of the flexure is substantially greater than its width, and the width of the flexure is substantially greater than its thickness. During operation, the flexure is maintained in a buckled state where the flexure's stiffness is significantly less than in the unbuckled state. In one implementation, a stage includes a flexure array joining a first frame and a second frame, where: the first frame and the second frame are substantially on a plane; the flexure array is substantially on the plane prior to buckling by the flexures of the flexure array; and the flexure array is bent substantially out of the plane after buckling by the flexures.

This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

A multi-axis accelerometer may include a proof mass, a first electrode set, and a second electrode set. The first electrode set may detect acceleration along a second axis of the accelerometer, and may include a first electrode (C1) and a second electrode (C2). The second electrode set may detect acceleration along a first axis of the accelerometer that is orthogonal to the second axis, and may include a third electrode (C3) and a fourth electrode (C4). Application of a force along only the second axis may result in the exhibition of a non-zero change in differential capacitance between at least C1 and C2, but a zero net change in the differential capacitance between at least C3 and C4. As such, the accelerometer may exhibit little or no cross axis sensitivity in response to the applied force.

A microelectromechanical accelerometer includes a microstructure, having sensing terminals and driving terminals distinct from the sensing terminals, a supporting body and a movable mass, coupled to the supporting body so as to be able to oscillate according to a sensing axis with respect to a rest position, and a control unit coupled to the microstructure so as to form a force feedback loop configured to maintain the movable mass in the rest position. The movable mass includes a sensing structure and a driving structure, respectively coupled to the sensing terminals and to the driving terminals through capacitive couplings variable as a function of displacements of the movable mass from the rest position. The sensing structure and the driving structure are electrically insulated and rigidly coupled with each other.

A multi-axis MEMS assembly is configured to provide multi-axis movement and includes: a first in-plane MEMS actuator configured to enable movement along at least an X-axis; and a second in-plane MEMS actuator configured to enable movement along at least a Y-axis; wherein the first in-plane MEMS actuator is coupled to the second in-plane MEMS actuator.

A micromechanical sensor core for an inertial sensor, having a movable seismic mass, a defined number of anchor elements, by which the seismic mass is fastened on a substrate, a defined number of stop devices fastened on the substrate for stopping the seismic mass, a first springy stop element, a second springy stop element and a solid stop element being developed on the stop device. The stop elements are designed in such a way that the seismic mass is able to strike in succession against the first springy stop element, the second springy stop element and the solid stop element.

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.