A physical quantity sensor includes, when three directions orthogonal to one another are defined as a first direction, a second direction, and a third direction, a substrate; and a moving member facing the substrate in the third direction via a gap and becoming displaced in the third direction in relation to the substrate. The moving member has a first region that has a plurality of penetration holes penetrating the moving member in the third direction and having a square opening shape as viewed from the third direction, and a second region having no penetration hole. At least one of a length in the first direction and a length in the second direction of the second region is equal to or greater than S0+2×S1, where S0 is a length of one side of the penetration hole, and S1 is a space between the penetration holes next to each other.

A light deflector includes a stationary part; a movable unit having a reflecting surface; a connecting part between the movable unit and the stationary part; a drive unit disposed on a first surface of the connecting part, the drive unit configured to deform the connecting part to oscillate the movable unit; and a rib disposed on a second surface of the connecting part, the second surface being an opposite surface of the first surface. The rib includes a portion whose longitudinal direction is orthogonal to a direction at which the connecting part is bent.

A method of making a MEMS actuator with a monolithic body of semiconductor material includes forming a supporting portion of semiconductor material, orientable with respect to first and second rotation axes, the first rotation axis being transverse with respect to the second rotation axis, and forming a first frame of semiconductor material. The method further includes forming first deformable elements, of semiconductor material, coupled to the first frame, and configured to control a rotation of the supporting portion about the first rotation axis. The method also includes forming a second frame of semiconductor material, and forming second deformable elements, of semiconductor material, coupled to the first frame and to the second frame, and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements are formed to carry respective first and second piezoelectric actuation elements.

A micromechanical component includes an adjustable part, a mounting, at least one bending actuator, and a permanent magnet. The part is positioned on the mounting so as to be adjustable relative to the mounting about a first rotation axis and about a second rotation axis inclined relative to the first axis. The actuator includes at least one movable subregion. Movement of the subregion results in a restoring force that moves the part about the first axis. The part is connected indirectly to the magnet to be adjustable about the second axis of rotation via a magnetic field built up by the magnet together with a yoke device of the component or an external yoke. A micromirror device includes the micromechanical component. A method for adjusting the part includes adjusting the part simultaneously about the first and the second axes.

An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.

A microelectromechanical system (MEMS) actuator device includes a substrate; a shape memory alloy over the substrate; and a reflective coating on the shape memory alloy. The shape memory alloy and the reflective coating form a bi-layer cantilever beam having a first end anchored to the substrate, and a second end released from the substrate. The second end of the cantilever beam articulates between a deflection configuration away from the substrate and a non-deflection configuration towards the substrate based on a thermal phase change in the shape memory alloy.

A micromechanical assembly having a holder, a drive frame which has at least one energizable coil device disposed at least one of on and in the drive frame and which is joined to the holder via at least one frame spring, a mirror element that is at least partially framed by the drive frame and is suspended from the drive frame by a first mirror spring and a second mirror spring, the mirror element being disposed between the two mirror springs and being adjustable about a mirror axis of rotation in relation to the drive frame, and the mirror element being suspended from the drive frame asymmetrically relative to the mirror axis of rotation. A method for manufacturing a micromechanical assembly is also described. A method for operating a micromechanical assembly is also described.

A micromechanical mirror device has: a plate-shaped mirror having a reflecting surface for reflecting light, the reflecting surface being configured to be planar; a closed frame structure supporting the plate-shaped mirror and completely framing an edge of the plate-shaped mirror; a spring arrangement having at least two spring structures arranged mirror-symmetrically and connecting the closed frame structure to a stationary support structure, the spring arrangement being configured such that the closed frame structure and the plate-shaped mirror can be brought into a resonant vibrational state with respect to the support structure; and a connecting arrangement having at least four connecting spring structures arranged mirror-symmetrically and each connecting the plate-shaped mirror to the closed frame structure; the connecting spring structures being configured to be elastically deformable and arranged such that they deform back and forth in the resonant vibrational state so that the plate-shaped mirror is partially mechanically decoupled from the closed frame structure.

The application describes MEMS transducers having a vent structure provided in a flexible membrane of the vent structure The vent structure comprises at least one moveable portion and the vent structure is configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about first and second axes of rotation, which axes of rotation extend in the plane of the membrane.

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.