MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity from a region underlying the substrate.

A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.

A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number. The analysis module executes a comparison process to compare the frequency-domain data with a predetermined spectrum feature table and generates a notification signal according to the comparison result.

A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.

A microphone assembly includes: a microphone with a first acoustic port, wherein the microphone is configured to convert acoustic waves into an electric signal; a filter housing with a second acoustic port; and a carrier coupled to the microphone and to the filter housing, wherein the carrier and the filter housing together enclose a cavity with a first acoustic passage fluidly connecting the first acoustic port and the second acoustic port; wherein the cavity comprises an acoustic chamber and a second acoustic passage; and wherein the second acoustic passage is in fluid communication with the first acoustic passage and with the acoustic chamber, and wherein the acoustic chamber and the second acoustic passage together establish a Helmholtz resonator for suppressing acoustic energy within a first frequency band in the acoustic waves propagating through the first acoustic passage, wherein the first frequency band is in an ultrasound frequency domain.

The disclosure relates to a MEMS sensor and an assembly including the MEMS sensor and an electrical circuit disposed in an assembly housing. The sensor includes a suspended structure (148) having a top diaphragm (118), a central electrode (120) and a bottom diaphragm (122) connected by a pillar portion (134). A peripheral portion of the suspended structure is coupled to a support structure (114), forming a low pressure cavity (130). The MEMS sensor includes a top electrode (136) disposed between the top diaphragm and the central electrode and a bottom electrode (138) disposed between the bottom diaphragm and central electrode each coupled to the support structure, wherein in the event of a sound pressure condition, the suspended structures moves up or down together, while the top electrode and the bottom electrode remain substantially stationary.

Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer, the integrated circuit configured to generate an output signal indicative of the acoustic activity based on the electrical signal from the acoustic transducer. An enclosure is coupled to the substrate and defines an internal volume between the enclosure and the substrate, the enclosure having an outer surface exposed to an outside environment of the microphone assembly, and an inner surface adjacent the internal volume. An insulating layer is disposed on the inner surface of the enclosure. The insulating layer comprises a fluoropolymer.