Methods, apparatuses and methods of manufacture are described for a MEMS mirror array with reduced crosstalk. The MEMS mirror array has a plurality of reflective surfaces wherein each reflective surface has a resonant frequency, and further wherein adjacent reflective surfaces do not have the same resonant frequency.

A wafer-level package for micro-acoustic devices and a method of manufacture is provided. The package comprises a base wafer with electric device structures. A frame structure is sitting on top of the base wafer enclosing particular device areas for the micro-acoustic devices. A cap wafer provided with a thin polymer coating is bonded to the frame structure to form a closed cavity over each device area and to enclose within the cavity the device structures arranged on the respective device area.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

A MEMS (micro-electromechanical system) actuator includes a substrate, a first electrode structure that is stationary with respect to the substrate, wherein the first electrode structure comprises a plurality of partial electrode structures, each of which comprises an edge structure and can be electrically controlled separately and a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electronically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into a discrete deflection position, wherein the edge structures of the first and second electrode structures are configured to be opposite to each other with respect to a top view and the opposite portions are spaced apart by a lateral distance.

A MEMS (micro-electromechanical system) actuator element includes a substrate, a stationary first electrode structure with an edge structure, a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electrostatically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into an intermediate position between a minimum and maximum vertical deflection position, wherein the minimum and maximum deflection position specify a maximum deflection path, wherein the edge structures of the first and second electrode structures are to each other and are vertically spaced apart in the minimum deflection position and wherein, in the maximum deflection position, the vertical immersion path of the edge structure of the second electrode structure into the edge structure of the first electrode structure is up to 0.5 times the maximum deflection path z.sub.Sz.sub.S.

A showerhead for a processing chamber includes a faceplate with a plurality of openings. A plurality of compartments are recessed into a top surface of the faceplate. The showerhead includes a plurality of MEMS devices. Each MEMS device is disposed in a corresponding compartment of the plurality of compartments. A printed circuit board including a plurality of ports therethrough is coupled to each MEMS device. Each MEMS device is configured to regulate a gas flow into each corresponding compartment through a corresponding port of the plurality of ports in the printed circuit board.

A piezoelectric micromachined ultrasonic transducer (PMUT) includes a substrate, a stopper, and a membrane, where the substrate and the stopper are composed of same single-crystalline material. The substrate has a cavity penetrating the substrate, and the stopper protrudes from a top surface of the substrate and surrounds the edge of the cavity. The membrane is disposed over the cavity and attached to the stopper.

A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.

An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.