The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

Electronic device including: a MEMS sensor device including a functional structure which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap including a semiconductive substrate; and a bonding dielectric region, which mechanically couples the cap to the MEMS sensor device. The cap further includes a conductive region, which extends between the semiconductive substrate and the MEMS sensor device and includes: a first portion, which is arranged laterally with respect to the semiconductive substrate and is exposed, so as to be electrically coupleable to a terminal at a reference potential by a corresponding wire bonding; and a second portion, which contacts the semiconductive substrate.

Disclosed herein are MEMS devices and systems and methods of manufacturing or operating the MEMS devices and systems. In some embodiments, the MEMS devices and systems are used in imaging applications.

A capacitive micromachined ultrasonic transducer (CMUT) and methods of forming the same are disclosed herein. In one implementation, the CMUT comprises a glass substrate having a cavity; a patterned metal bottom electrode situated within the cavity of the glass substrate; and a vibrating plate comprising at least a conducting layer, wherein the vibrating plate is anodically bonded to the glass substrate to form an air-tight seal between the vibrating plate and the substrate and wherein a pressure inside the cavity is less than atmospheric pressure (i.e., a vacuum). In another implementation, the CMUT comprises a glass substrate with Through-Glass-Via (TGV) interconnects, wherein a metal electrode is electrically connected to a TGV and wherein said metal electrode can be in the bottom of a cavity of the glass substrate or on the vibrating plate.

A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

The present subject matter relates to charge pump devices, systems, and methods in which a plurality of series-connected charge-pump stages are connected between a supply voltage node and a primary circuit node, and a discharge circuit is connected to the plurality of charge-pump stages, wherein the discharge circuit is configured to selectively remove charge from the primary circuit node.

A MEMS (micro-electromechanical system) actuator element includes a substrate, a stationary first electrode structure with an edge structure, a second electrode structure with an edge structure, wherein the second electrode structure is deflectably coupled to the substrate by means of a spring structure and electrostatically deflectable by means of the first electrode structure to move the edge structure of the second electrode structure into an intermediate position between a minimum and maximum vertical deflection position, wherein the minimum and maximum deflection position specify a maximum deflection path, wherein the edge structures of the first and second electrode structures are to each other and are vertically spaced apart in the minimum deflection position and wherein, in the maximum deflection position, the vertical immersion path of the edge structure of the second electrode structure into the edge structure of the first electrode structure is up to 0.5 times the maximum deflection path z.sub.S.

A fluidic microelectromechanical system (MEMS) device includes fluid interaction elements (FIEs) that are configured to be monitored by a sensing device to generate an electrical signal in response to a fluid flow through the device. The FIEs include a serial arrangement of cantilevered lever arms to achieve increased sensitivity in a fluid flow sensor as compared to some conventional MEMS devices.

Controllable electromechanical adhesive devices including three-dimensional dielectrically-coated microstructures that are mechanically compliant are provided. The microstructures can be controlled to provide tunable electromechanical surface adhesion, allowing for dexterous gripping of microscale and/or macroscale objects. For example, the devices can tune the surface adhesion strength of one or more microstructures without complex mechanical actuation in a wide range of on/off ratios with low voltage. The devices can be configured as a force sensor capable of providing tactile feedback for determining the load applied against the microstructures by the surface of an object. For example, the devices can provide output indicative of changes in an electrical property of one or more microstructures for determining the applied load of an object. The devices can be pixelated or otherwise configured to provide localized force sensing and/or surface adhesion. Related systems and methods for controlling the disclosed electromechanical adhesive devices are also described.

An anti-fouling surface having micron scale pillars embedded with Fe.sub.3O.sub.4 nanoparticles is designed. The pillars may be repeatedly induced to move according to a predetermined frequency, such as one that mimic that of the beating movement of natural cilia, through the application of a magnetic field. When square-shaped pillars with a height of 10 m, width of 2 m, and inter-pattern distance of 5 m actuated for three minutes, more than 99.9 percent of biofilm cells were detached and via gentle rinsing from the surface having the pillars. The anti-fouling surface enables effective prevention of biofilm formation and removal of established biofilms, and can be applied to a broad spectrum of polymers.