A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

The present disclosure provides microstructured hydrophobic surfaces and devices for gripping wet deformable surfaces. The surfaces and devices disclosed herein utilize a split contact Wenzel-Cassie mechanism to develop multi-level Wenzel-Cassie structures. The Wenzel-Cassie structures are separated with a spatial period corresponding to at least one wrinkle eigenmode of a wet deformable surface to which the microstructure or device is designed to contact, allowing grip of the deformable surface without slippage. Microstructures of the present invention are specifically designed to prevent the formation of Shallamach waves when a shear force is applied to a deformable surface. The multi-level Wenzel-Cassie states of the present disclosure develop temporally, and accordingly are characterized by hierarchical fluid pinning, both in the instance of slippage, and more importantly in the instance of localization. This temporal aspect to the multi-level Wenzel-Cassie state delays or prevents the transition from a wrinkled eigenmode state in a deformable surface to a buckled state in a deformable surface.

A contact having a first contact member having an exposed surface, the exposed surface having irregularities, undulations, or asperities that form one or more high points and low points on the exposed surface, a second contact member having a contact base surface, a plurality of electrically conductive flexures extending from the contact base surface, and when the first contact member is positioned adjacent to the second contact member in a closed position in which the contact base surface of the second contact member is not in electrical contact with the one or more high points on the exposed surface of the first contact member, each flexure of the plurality of flexures is in electrical contact with the exposed surface of the first contact member.

Provided is a nanowire array, in which a plurality of nanowires are densely packed and in contact with each other via side walls to form a three-dimensional, compact layer structure, wherein the plurality of nanowires are formed from InGaN-based material. Also provided is an optoelectronic device comprising the nanowire array which is epitaxially grown on a surface of a substrate (12). Further provided are methods for preparing the nanowire array and the optoelectronic device.

According to one embodiment, a sensor includes a sensor portion that includes a first resistance element, a first opposing resistance element, a second resistance element, a second opposing resistance element, a third resistance element, a third opposing resistance element, a fourth resistance element, a fourth opposing resistance element, and a first conductive member. A direction from the first resistance element to the first opposing resistance element and a direction from the second resistance element to the second opposing resistance element are along a first direction. A second direction from at least a part of the first resistance element to the second resistance element crosses the first direction. A third direction from the third resistance element to the third opposing resistance element crosses a plane including the first and second directions. A direction from the fourth resistance element to the fourth opposing resistance element is along the third direction.

The invention relates to a MEMS package comprising a package substrate and at least one MEMS element. The at least one MEMS element comprises a MEMS interaction region and is embedded in the package substrate in such a way that at least the MEMS interaction region remains free. The MEMS package is characterized in that one or more antennas for transmitting and/or receiving electromagnetic signals are present on or in the package substrate, wherein the package substrate functions as an antenna substrate for the one or more antennas.

The invention also relates to a method for producing the MEMS package according to the invention. For this purpose, the package substrate and/or conductor tracks are first provided by an additive manufacturing process, preferably by a multi-material additive manufacturing process. The at least one MEMS element is then at least partially embedded in the package substrate such that at least the MEMS interaction region remains free. Furthermore, the one or more antennas are mounted on or in the package substrate.

A nanohole template is disclosed which includes a substrate and a vertically aligned nanocomposite (VAN) structure disposed over the substrate. The VAN structure is a metal nitride having circular periodic nanoholes of about 2 nm to about 20 nm in diameter.

A method of fabricating a nanohole template includes growing vertically aligned nanocomposite (VAN) structure having a plurality of nanoholes with metal disposed therein, and selectively wet chemical etching the metal with an etchant to a predetermined level.

Monolithic microelectromechanical systems (MEMS) based spatial light modulators (SLM) including ribbon-type modulators and drivers integrally fabricated in or on a common substrate are provided. Generally, the monolithic MEMS-based SLM includes a common electrode in or on a substrate, a number of electrostatically displaceable ribbons, each including a tensile, amorphous silicon-germanium layer (SiGe layer) that serves as a structural layer and as a ribbon electrode, and a light reflective surface on the SiGe layer facing away from the surface on the substrate. A driver including a plurality of drive channels monolithically integrated in the substrate below the surface, the driver electrically coupled to the common electrode and each ribbon electrode and operable to apply voltages thereto to drive the plurality of ribbons to modulate light reflected from the light reflective surfaces.

Encapsulated MEMS devices and methods of fabrication with wafer-level fabrication processes are described which address small molecule diffusion into hermetically sealed cavities. In some configurations a small molecule barrier layer, or hydrogen barrier layer, is formed during a back-end-of-the-line (BEOL) processing over a cap wafer including a planarized surface formed during a via reveal griding operation. In some configurations a small molecule barrier layer is not formed over the planarized surface during BEOL processing in order to allow an escape path for small molecules. In some configurations a small molecule barrier layer, or hydrogen barrier layer, is formed on a bottom side of a cap wafer prior to bonding the cap wafer to a device wafer during wafer-level fabrication.