Patent classifications
B81B2207/056
Textiles having a microstructured surface and garments comprising the same
The present invention relates to textile articles and clothing such as outdoor garments, indoor garments, and commercial protective wear exposed to contact mixtures of water and oil, swimwear and winter wear exposed to mixtures of water and air. At least part of these textile articles possess a surface provided with at least one of 1) a high surface area, 2) hierarchical pattern, 3) contact angles such that hydrophilic portion of a contact mixture possesses a high contact angle and the hydrophobic portion of a contact mixture possesses a low contact angle, and 4) hysteresis angle greater than 5 degrees. Hydrophobic/Hydrophilic contact mixtures of the present invention can be surfaces where water and or ice are present in combination with oil and or air. The textile articles of the present invention resist slippage on surfaces possessing hydrophobic/hydrophilic contact mixtures.
Micro pick up array and manufacturing method thereof
A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.
METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE SUBSTRATE
Method and arrangement for assembling one or more microchips (415; 615; 715; 815; 915; 1015) into one or more holes (422; 722), respectively, in a substrate surface (421; 721) of a separate receiving substrate (420; 720; 820; 1020). The holes (422; 722) of the substrate is for microchip insertion out-of-plane in relation to said substrate surface. Each of said microchips is provided with a ferromagnetic layer (213; 613) of ferromagnetic material. The microchips are placed (503) on said substrate surface (421; 721) and it is applied and moved (504) one or more magnetic fields affecting said ferromagnetic layer (213; 613) of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface (421; 721) and move over the substrate surface (421; 721) until assembled into said holes (422; 722).
Diaphragm assembly with non-uniform pillar distribution
A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.
Using sacrificial polymer materials in semiconductor processing
In an example, a wet cleaning process is performed to clean a structure having features and openings between the features while preventing drying of the structure. After performing the wet cleaning process, a polymer solution is deposited in the openings while continuing to prevent any drying of the structure. A sacrificial polymer material is formed in the openings from the polymer solution. The structure may be used in semiconductor devices, such as integrated circuits, memory devices, MEMS, among others.
Nanowire-Coated Microdevice and Method of Making and Using the Same
A microdevice containing a plurality of nanowires on a biocompatible surface, and methods of making and using the same are provided. Aspects of the present disclosure include forming a plurality of microdevices on a substrate where each microdevice includes a plurality of nanowires. The nanowires may be loaded with an active agent by disposing the active agent onto the surface of the nanowires. Also provided herein are kits that include the subject microdevices.
Methods for micro and nano fabrication by selective template removal
A method to remove selected parts of a thin-film material otherwise uniformly deposited over a template is disclosed. The methods rely on a suitable potting material to encapsulate and snatch the deposited material on apexes of the template. The process may yield one and/or two devices during a single process step: (i) thin-film material(s) with micro- and/or nano-perforations defined by the shape of template apexes, and (ii) micro- and/or nano-particles shaped and positioned in the potting material by the design of the template apexes. The devices made from this method may find applications in fabrication of mechanical, chemical, electrical and optical devices.
Highly ordered arrays of micelles or nanoparticles on a substrate surface and methods for producing the same
The invention provides a method for increasing the order of an array of polymeric micelles or of nanoparticles on a substrate surface comprising a) providing an ordered array of micelles or nanoparticles coated with a polymer shell on a substrate surface and b) annealing the array of micelles or nanoparticles by ultrasonication in a liquid medium which is selected from the group comprising H.sub.2O, a polar organic solvent and a mixture of H.sub.2O and a polar organic solvent. In a related aspect, the invention provides the highly ordered arrays of micelles or nanoparticles obtainable by the methods of the invention.
Preparation method of bionic adhesive material with tip-expanded microstructural array
A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.
Method for manufacturing microscopic structural body
A method for manufacturing a molded product with fine structure includes steps of, in a temperature-controlled stamper mold provided with a fine structure including a concavo-convex pattern having a width of 10 nm to 1 μm, forming a thermoplastic molten polymer layer to be in contact with the fine structure 20 of the stamper mold having been kept at a predetermined temperature and holding the thermoplastic molten polymer layer for a predetermined time so as to transfer the fine structure of the stamper mold to the thermoplastic molten polymer layer under gravity.