A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.

Two-axis MEMS Micromirror is disclosed featuring combs drive actuation with independent drive for each of two axes of rotation and a layered hinge design providing an improved shock and vibration performance. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, actuation voltages are driven to an inner axis through multiple layers in one or more outer hinges, allowing for a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration. Furthermore, this novel design achieves set angles that are highly stable over time.

A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 m into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

A wafer structure configured for wafer-level calibration of a plurality of pressure sensors, the wafer structure includes: a microelectromechanical systems (MEMS) wafer that includes a plurality of MEMS dice that are separated by a plurality of MEMS-wafer dicing areas; an application-specific integrated circuit (ASIC) wafer that includes a plurality of ASIC-wafer dice that are separated by a plurality of ASIC-wafer dicing areas; a Film on Wafer (FOW) that bonds the MEMS wafer to the ASIC wafer; a plurality of thru silicon vias (TSVs) extending through the ASIC wafer; and a plurality of metallizations extending through the FOW thereby creating an electrical connection between the ASIC wafer and the MEMS wafer thereby enabling wafer-level calibration of the plurality of pressure sensors. The MEMS wafer and the ASIC wafer may each include alignment features for aligning the MEMS wafer with the ASIC wafer.

The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged. The first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface. The mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip.

A microelectronics H-frame device includes: a stack of two or more substrates wherein the substrate stack comprises a top substrate and a bottom substrate, wherein bonding of the top substrate to the bottom substrate creates a vertical electrical connection between the top substrate and the bottom substrate, wherein the top surface of the top substrate comprises top substrate top metallization, wherein the bottom surface of the bottom substrate comprises bottom substrate bottom metallization; mid-substrate metallization located between the top substrate and the bottom substrate; a micro-machined top cover bonded to a top side of the substrate stack; and a micro-machined bottom cover bonded to a bottom side of the substrate stack.

The present disclosure discloses a micro-mirror array, and a backlight module and a display device using the same. Each reflection mirror in the micro-mirror array comprises a first axis of deflection and a second axis of deflection perpendicular to the first axis of deflection, and a deflection angle of the reflection mirror is controlled individually and continuously. The backlight module comprises a light source, a micro-mirror array and a control unit. The control unit adjusts a deflection angle of each reflection mirror in the micro-mirror array in response to a backlight control signal, so that depending on the backlight control signal, the micro-mirror array reflects light emitted from the light source evenly to an entire surface of the display screen or converges the light to one or more areas of the display screen.

The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.