A process for transferring microstructures to a flexible or rigid final substrate that offers advantages in both speed and precision is provided. The inventive process involves subjecting a transfer film in a continuous roll-to-roll process to the following operations: either forming microstructures on, or transferring microstructures to a surface of the transfer film; and then transferring the microstructures from the transfer film onto a surface of the final substrate. The microstructures are single or multi-layer structures that are made up of: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof.

The invention relates to a method for depositing nano-objects on the surface of a gel comprising the steps of: a) providing a gel having a polymer matrix and a solvent within the polymer matrix, the polymer matrix forming a three-dimensional network which is capable of swelling in the presence of the solvent, wherein the solubility of the polymer matrix in the solvent at 1 bar and 25 C. is less than 1 g/l, wherein the gel has a rigidity gradient on the micrometer scale of less than 10%, then b) depositing nano-objects on the surface of the gel, the nano-objects having a mean diameter greater than or equal to the mean diameter of the pores of the gel, then c) evaporating the solvent from the gel at least until the content of solvent no longer varies over time, under the proviso that, at the start of evaporation, the content of mineral salts in the solvent is less than 6 g/l, the gel capable of being obtained and the uses thereof.

The invention relates to imparting surfaces with nanometer sized structures that provide bactericidal properties to the surface and devices. In one embodiment, the present invention provides a bactericidal surface with nanometer sized pillars created by imprinting a softened polymer surface with a mold. In another embodiment, the nanometer sized pillars are part of a medical device with antibacterial properties.

A method for manufacturing a flow path device internally provided with a flow path for allowing a liquid to flow by compression bonding two or more members to each other, in which the hydrophilic property of a surface of the flow path can be maintained for a long period of time. A flow path device is manufactured by forming a hydrophilic coating film using a treatment liquid including a hydrophilizing agent in at least one member, the coating film covering a surface of the member at a side to be joined to another member, then irradiating only a joining surface of the coating film with ultraviolet rays or plasma derived from an oxygen-containing gas in the member having the coating film, and irradiating at least the joining surface with ultraviolet rays or plasma derived from an oxygen-containing gas in a member having no coating film, and compression bonding the two or more members.

A microfluidic product utilizing gradient surface energy coatings for fluid control comprising a plurality of fluid passages wherein at least one fluid passage comprises a coating configured to control liquid flow wherein the coating configured to control liquid flow comprises a gradient surface energy coating from a proximal location to a distal location on a surface of the fluid passage. The product can include uniform regions and surface gradient regions in the same passage. Coating compositions and product dimensions can be selected to provide control over different flow properties including fluid velocity, reduction and acceleration of fluid flow, and starting and stopping fluid flow.

Aspects include methods of fabricating antibacterial surfaces for medical implant devices including patterning a photoresist layer on a silicon substrate and etching the silicon to generate a plurality of nanopillars. Aspects also include removing the photoresist layer from the structure and coating the plurality of nanopillars with a biocompatible film. Aspects also include a system for preventing bacterial infection associated with medical implants including a thin silicon film including a plurality of nanopillars.

A semiconductor device includes a first passivation layer disposed on a semiconductor base. The semiconductor device further includes a dielectric layer disposed on the first passivation layer. The semiconductor device further includes a plurality of pillars disposed in an opening in the dielectric layer and the first passivation layer and from a top surface of the semiconductor base. The semiconductor device further includes a metal layer disposed on the exterior surfaces of the plurality of pillars and sidewalls of the dielectric layer and the first passivation layer and on the exposed top surface of the semiconductor base. The semiconductor device further includes a second passivation layer disposed on the metal layer and a top surface of the semiconductor device; wherein the second passivation layer has an electrical charge.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

A method of manufacturing a microneedle according to the present disclosure includes a step of preparing a microneedle; a step of cooling the microneedle; and a step of inducing an endothermic reaction of the cooled microneedle, and coating the cooled microneedle with an active ingredient at least once. In accordance with such a configuration, coatability of the active ingredient can be improved due to an endothermic reaction without a separate drying process, thereby providing superior medication.

A semiconductor device includes a first passivation layer disposed on a semiconductor base. The semiconductor device further includes a dielectric layer disposed on the first passivation layer. The semiconductor device further includes a plurality of pillars disposed in an opening in the dielectric layer and the first passivation layer and from a top surface of the semiconductor base. The semiconductor device further includes a metal layer disposed on the exterior surfaces of the plurality of pillars and sidewalls of the dielectric layer and the first passivation layer and on the exposed top surface of the semiconductor base. The semiconductor device further includes a second passivation layer disposed on the metal layer and a top surface of the semiconductor device; wherein the second passivation layer has an electrical charge.