Methods and systems for direct atomic layer etching and deposition on or in a substrate using charged particle beams. Electrostatically-deflected charged particle beam columns can be targeted in direct dependence on the design layout database to perform atomic layer etch and atomic layer deposition, expressing pattern with selected 3D-structure. Reducing the number of process steps in patterned atomic layer etch and deposition reduces manufacturing cycle time and increases yield by lowering the probability of defect introduction. Local gas and photon injectors and detectors are local to corresponding columns, and support superior, highly-configurable process execution and control.

The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), and depositing a second electrode layer (50) on the second dielectric film (40), wherein the first dielectric film (20) and/or the second dielectric film (40) comprises a first layer comprising an oxide, a second layer comprising a high-k material, and a third layer comprising an oxide, and wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.

Provided is a method of arranging particles on a substrate, the method including: (a) preparing a substrate, a surface of which has depressions or projections capable of fixing the positions and/or orientations of one or more particles; and (b) placing the particles on the substrate and applying a physical pressure to the particles so that a portion or the whole of each particle is inserted in each of pores defined by the depressions or the projections. Provided is also a method of arranging particles on a substrate, the method including: (a) preparing a substrate, at least a surface portion of which has adhesive property; and (b) placing particles, which do not have flat facets but curved surfaces, on the substrate and applying a physical pressure to the particles so that the particles are immobilized on adhesive surface portions of the substrate.

Methods for depositing materials on patterned substrates, and related devices, are generally provided. In some embodiments, a material is deposited on a patterned substrate. In certain embodiments, the substrate comprises a first portion with a material deposited on the first portion and a second portion of the substrate essentially free of the material. The methods described herein may be useful in fabricating sensors, circuits, tags, among other devices. In some cases, devices for determining analytes are also provided.

The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.

Membrane fabrication including: depositing a bottom Molybdenum (Mo) layer; depositing a polyimide (PI) layer and defining a first release hole; curing the PI layer; depositing a top Mo layer; and defining and etching a second release hole within the first release hole.

Method for producing a directed monolayer or multilayer assembly of colloidal nanoparticles attached to an electret substrate, including imparting a surface electric potential to an electret substrate according to a pattern of positive and/or negative electric charges, and contacting an electret substrate with a colloidal dispersion. The colloidal dispersion has electrically neutral or near neutral and electrically polarizable colloidal nanoparticles, and a nonpolarizing or weakly polarizing dispersion medium. The absolute value of the surface electric potential and the concentration of polarizable nanoparticles are no lower than a first surface electric potential threshold and no lower than a second concentration threshold, respectively, such as to obtain an assembly having a desired geometric shape, at least the first layer of which is compact in terms of the absence of undesired gaps having sizes greater than the size of two adjacent nanoparticles, preferably not greater than the size of one nanoparticle.

A device and method utilizes interconnecting layers separated by an insulating layer. A layered structure comprises a first and a second layer of electrically conductive material, and a third layer of electrically insulating material between them. A via trench is fabricated that extends from the second layer through the third layer into the first layer, a surface on the first layer of electrically conductive material forming a bottom surface of the via trench. An ink-jetting set-up for a mixture of liquid carrier and nanoparticles of conductive material is formed, and a specific process period is determined. Capillary flow of nanoparticles to peripheral edges of an ink-jetted blob of said mixture is induced. The mixture is ink-jetted into a blob on the via trench; the layered structure is heated to evaporate the liquid carrier. The interconnection element is higher at a certain point than between opposing side walls.

The present invention provides a method for manufacturing a bowl-shaped structure, a bowl-shaped structure manufactured thereby, and a bowl array using the bowl-shaped structure, wherein the method for manufacturing the bowl-shaped structure comprises the following steps: putting into contact a first substrate, on which a particle alignment layer is formed, and a second substrate so as to transfer the particle alignment layer to the second substrate; forming a particle-thin film complex by coating the particle alignment layer that is transferred on the second substrate with a thin film formation substance; removing a portion of the thin film formation substance from the complex to expose particles, and then removing the exposed particles to form a template having a hole; and forming the bowl-shaped structure by coating a first substance on the surface of the hole of the template and then removing the template.

A method of transfer printing comprises globally heating an array of stamps, where each stamp comprises a shape memory polymer with a light absorbing agent dispersed therein, and pressing the array of stamps to a donor substrate comprising a plurality of inks. Each stamp is thereby compressed from an undeformed adhesion-off configuration to a deformed adhesion-on configuration. The array of stamps is then cooled to rigidize the shape memory polymer and bind the plurality of inks to the stamps in the deformed adhesion-on configuration. The plurality of inks remain bound to the stamps while the array of stamps is positioned in proximity with a receiving substrate. A selected stamp in the array is then locally heated using a concentrated light source. The selected stamp returns to the undeformed adhesion-off configuration, and the ink bound to the selected stamp is released and transfer printed onto the receiving substrate.