The present disclosure addresses methods to refine the geometry of micro features manufactured in various substrates. Such refinement includes improvement in edge roughness and roughness of aperture channel walls. The methods include deposition of material onto feature edges and surfaces as well as placement of micro fabricated inserts into coarse features. Foremost among the candidate technologies that can be employed for these purposes are two photon polymerization-based 3D nano printing and atomic force microscope nanopipette-based electroplating.

A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process.

In an embodiment, a system includes: a chamber; and a magnetic assembly contained within the chamber. The magnetic assembly comprises: an inner magnetic portion comprising first magnets; and an outer magnetic portion comprising second magnets. At least two adjacent magnets, of either the first magnets or the second magnets, have different vertical displacements, and the magnetic assembly is configured to rotate around an axis to generate an electromagnetic field that moves ions toward a target region within the chamber.

A microelectronic device is formed by forming at least a portion of a substrate of the microelectronic device by one or more additive processes. The additive processes may be used to form semiconductor material of the substrate. The additive processes may also be used to form dielectric material structures or electrically conductive structures, such as metal structures, of the substrate. The additive processes are used to form structures of the substrate which would be costly or impractical to form using planar processes. In one aspect, the substrate may include multiple doped semiconductor elements, such as wells or buried layers, having different average doping densities, or depths below a component surface of the substrate. In another aspect, the substrate may include dielectric isolation structures with semiconductor material extending at least partway over and under the dielectric isolation structures. Other structures of the substrate are disclosed.

An inkjet-printing-base process for depositing functional materials, for example PZT, on a substrate, in various instances platinized silicon. Substrate templating (via SAMs) and material deposition are both performed by an inkjet printing process. Additionally, a composition to be used as a SAM precursor ink which is a thiol in a solvent mixture, wherein the composition can be 1 dodecanethiol in a solvent mixture of 2-methoxyethanol and glycerol.

A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process.

A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.

A printed structure including a plurality of overlying layers of elongate polymeric filaments stacked on a surface of a substrate. The elongate polymeric filaments are stacked on each other along their lengths to form a liquid impermeable, self-supporting wall. The liquid impermeable self-supporting wall forms a wall angle of about 30° to about 90° with respect to a plane of the surface of the substrate.

A method comprising: adhering a first surface of a mask to a carrier substrate via a first adhesive layer; forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark; bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer; performing an alignment operation based on imaging the first alignment mark and the second alignment mark; configuring the second surface of the mask to adhere to the third surface of the wafer via the second adhesive; and disconnecting the carrier substrate from the mask.

This invention teaches a method to achieve rapid 3D printing of microneedle patches. The 3D printing method comprises a printing nozzle of multiple micro-holes and cold plate/platform on which the microneedle-supporting sheet (membrane) is placed. The solution or aqueous solution of microneedle-forming materials is printed onto the cold microneedle-supporting sheet with programed rate of injection from the nozzle and velocity of the nozzle lifting. The relationship between the injection rate and the lifting velocity determines the shape of the microneedle tips. The freshly printed microneedles on the cold sheet are dried in two ways, drying at a temperature close to the ice point of water or drying after a freeze-thaw treatment of the microneedles.