B81C99/002

LENSLESS NEAR-CONTACT IMAGING SYSTEM FOR MICRO ASSEMBLY
20250184623 · 2025-06-05 ·

A machine vision system and method use lensless near-contact imaging with coherent illumination, or incoherent illumination, and high pixel count large format sensors (e.g., equivalent to at least 20 to 65 mega-pixels) to produce diffraction patterns of the micro-objects or the gray scale images of the micro-objects over a large overall field-of-view of the machine vision system. The machine vision system provides feedback to a microassembler system to position, orient, and assemble microscale devices like micro-LEDs over large working areas. The effective resolution of the machine vision system can be further improved through the use of gray scale and super-resolution image processing techniques.

MICRO-ASSEMBLER SYSTEM WITH MICRO-OBJECT TRAP LOCATIONS
20250187909 · 2025-06-12 ·

What is disclosed is a micro-assembler backplane that has a backplane having a first surface and a number of controlled electrodes, wherein each is selectively activatable to manipulate micro-objects on the backplane. The micro-assembler backplane also has at least one trap location that is separate from the controlled electrodes. The at least one trap location is configured to hold, independently of activation of the controlled electrodes, at least one micro-object that is manipulated into a trap location.

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Lensless near-contact imaging system for micro assembly

A machine vision system and method use lensless near-contact imaging with coherent illumination, or incoherent illumination, and high pixel count large format sensors (e.g., equivalent to at least 20 to 65 mega-pixels) to produce diffraction patterns of the micro-objects or the gray scale images of the micro-objects over a large overall field-of-view of the machine vision system. The machine vision system provides feedback to a microassembler system to position, orient, and assemble microscale devices like micro-LEDs over large working areas. The effective resolution of the machine vision system can be further improved through the use of gray scale and super-resolution image processing techniques.

METHOD AND SYSTEM FOR DEPOSITING A NANO-OBJECT ON A RECEIVING SURFACE AND FASTENING SYSTEM INCORPORATING SUCH A DEPOSITION SYSTEM
20250349569 · 2025-11-13 ·

A method for depositing a nano-object on a receiving surface comprises a first step of picking up this nano-object located on a carrying surface, a step of transferring the picked-up nano-object to the receiving surface, and a step of depositing the nano-object on the receiving surface. A cantilever transfer device comprising two spaced-apart arms is used to pick up, hold and release the nano-object.

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING MOIRÉ BASED METROLOGY AND VACUUM BASED PICK-AND-PLACE

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

Method and arrangement for assembly of microchips into a separate substrate

A method for assembling one or more microchips into respective holes in a substrate surface of a separate receiving substrate for microchip insertion that is out-of-plane in relation to the substrate surface. The microchips are placed on the substrate surface and moved by one or more magnetic fields affecting a ferromagnetic layer of each microchip so that the microchips become out-of-plane oriented in relation to the substrate surface and are assembled into the holes.

LENSLESS NEAR-CONTACT IMAGING SYSTEM FOR MICRO ASSEMBLY
20260075327 · 2026-03-12 ·

A machine vision system uses lensless near-contact imaging with coherent illumination, or incoherent illumination, and high pixel count large format sensors (e.g., equivalent to at least 20 to 65 mega-pixels) to produce diffraction patterns of the micro-objects or the gray scale images of the micro-objects over a large overall field-of-view of the machine vision system. The machine vision system provides feedback to a microassembler system to position, orient, and assemble microscale devices, such as micro-LEDs, over large working areas. The effective resolution of the machine vision system can be further improved by using grayscale and super-resolution image processing techniques.