A micro-electro-mechanical systems (MEMS) array system is configured to apply suction forces for the manipulation of objects. The MEMS system includes includes a two-dimensional MEMS array of a plurality of individual MEMS elements. Each MEMS element comprises: a casing structure; a flexible membrane attached to the casing structure; and an electrode structure, wherein a voltage applied to the electrode structure actuates the MEMS element to cause the flexible membrane to flex relative to the casing structure. The flexible membrane and the casing structure define a gap into which the flexible membrane may flex, and a foot extends from the flexible membrane in a direction away from the casing structure, wherein the foot and the flexible membrane define a clearance region on an opposite side of the flexible membrane from the gap. When the MEMS element interacts with an object to be manipulated the foot spaces the membrane apart from the object. The MEMS array system further includes a control circuit that selectively actuates one or more of the MEMS elements of the MEMS array.

A micro-electro-mechanical systems (MEMS) includes a flexible membrane that creates a suction force by flexing to permit manipulation of a microscale object. The MEMS element includes a casing structure; a flexible membrane attached to the casing structure; and an electrode structure, wherein a voltage applied to the electrode structure causes the flexible membrane to flex relative to the casing structure. The flexible membrane and the casing structure define a gap into which the flexible membrane may flex, and a foot extending from the flexible membrane in a direction away from the casing structure, wherein the foot and the flexible membrane define a clearance region on an opposite side of the flexible membrane from the gap. When the MEMS element interacts with an object to be manipulated the foot spaces the membrane apart from the object, and flexing of the membrane generates the suction force for manipulating the object.

A transfer head is provided. The transfer head includes a body having a plurality of arrays of grip regions with each of the arrays comprising at least two columns of the grip regions. The grip regions in one of the columns are electrically connected in series. The columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively.

A method for transferring a plurality of micro devices e is provided. The method includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process. The placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.

A micro device transfer head includes a base arm, a first side arm, a second side arm, and an isolation layer. The first side arm, including one or multiple first electrodes, is disposed on a first surface of the base arm and located on a first end of the base arm. The second side arm, including one or multiple second electrodes, is disposed on the first surface of the base arm and located on a second end of the base arm. The isolation later is disposed on the first surface of the base arm and covers the surface of the first side arm and the second side arm.

System and method that allow to jointly cause movement of multiple micro-and-nano-objects to desired positions are described. A high speed camera tracks the locations of the objects. An array of photo-transistor-controlled electrodes is used to generate a dynamic potential energy landscape for manipulating objects with both DEP and EP forces, and a video projector is used actuate the array. One or more computing devices are used to: process images captured by the camera to estimate positions of the objects; generate desired trajectories of the objects using an objective function; compare the desired chiplet positions with current positions and generate input signals to minimize the error between them; and map the control inputs to images that are projected on the array using a video project. The projected images activate or deactivate electrodes, as indicated by the control inputs.

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir? alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.

A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Disclosed is a component for manufacturing micro- and/or nanostructured devices. The component has a base body and a surface which has micro- or nanostructures which form a substantially flat support surface, and between which trenches extend with a statistical distribution, to which a vacuum can be applied. Also disclosed is a method of manufacturing such a component.