A transfer head is provided. The transfer head includes a body having a plurality of arrays of grip regions with each of the arrays comprising at least two columns of the grip regions. The grip regions in one of the columns are electrically connected in series. The columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively.

A method for transferring a plurality of micro devices e is provided. The method includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process. The placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.

A device (30, 40) for the transfer of a plurality of watch components (2) arranged on a first support (10) to their arrangement on a second support (20), wherein it comprises an inlet surface (31, 41) comprising inlet orifices (33, 43) so arranged as to correspond to a first arrangement of the watch components (2) on a first support (10), an outlet surface (32, 42) comprising outlet orifices (34, 44) so arranged as to correspond to a second arrangement of the watch components (2) on a second support (20), and guide elements (35, 45) adapted to guide the watch components (2) automatically from the inlet orifices (33, 43) to the outlet orifices (34, 44).

A micro assembly having a substrate and an operating plane coupled to the substrate. The operating plane is movable from an in-plane position to an out-of-plane position. One or more electric connections provide electric power from the substrate to the operating plane in the out-of-plane position. A tool is coupled to the operating plane. The tool is operable to receive electric power from the operating plane to perform work.

A method of assembling a group of devices, the method comprising the steps of: evacuating a space between each component of a first group of two or more components on a source device and a transfer device thereby to create a temporary bond between each component of the first group of two or more components and the transfer device; selectively removing the first group of two or more components from the source device whilst the transfer device is temporarily bonded to each component of the first group of two or more components on the source device; positioning the first group of two or more components on a host device; and decoupling the first group of two or more components from the transfer device, thereby to form a first group of assembled devices.

An intermediate transfer surface includes a substrate, a two-dimensional array of electrodes, a dielectric spacer layer on the two-dimensional array of electrodes, and a voltage controller electrically connected to the array of electrodes. A method of manufacturing an intermediate transfer surface, depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A microassembly system includes an assembly surface having a first two dimensional array of potential wells on a first surface, a first voltage source electrically connected to the first array of potential wells, an intermediate transfer surface having a second two dimensional array of potential wells on a second surface arranged to face the first surface, and a second voltage source electrically connected to the second array of potential wells.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.

System and method that allow utilize machine learning algorithms to move a micro-object to a desired position are described. A sensor such as a high speed camera or capacitive sensing, tracks the locations of the objects. A dynamic potential energy landscape for manipulating objects is generated by controlling each of the electrodes in an array of electrodes. One or more computing devices are used to: estimate an initial position of a micro-object using the sensor; generate a continuous representation of a dynamic model for movement of the micro-object due to electrode potentials generated by at least some of the electrodes and use automatic differentiation and Gauss quadrature rules on the dynamic model to derive optimum potentials to be generated by the electrodes to move the micro-object to the desired position; and map the calculated optimized electrode potentials to the array to activate the electrodes.

A roll micro-transfer printer comprises a source substrate having sacrificial portions spaced apart by anchors and micro-devices each disposed exclusively in association with a sacrificial portion and physically connected to at least one of the anchors by a tether. A roll stamp comprising a visco-elastic material disposed in alignment with the source substrate contacts micro-devices on the source substrate to fracture or separate the tether and adhere the micro-devices to the roll stamp. A destination substrate disposed in alignment with the roll stamp contacts micro-devices on the roll stamp and adheres the micro-devices to the destination substrate. The roll stamp is disposed to rotate about a roll stamp axis, the source substrate transport is disposed to translate in a source substrate direction orthogonal to the roll stamp axis, and the destination substrate transport is disposed to translate in a destination substrate direction opposite to the source substrate direction.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.