A semiconductor package includes a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region. The semiconductor package further includes a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die. The film has a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap. Electrical conductors are attached at a first end to pads at the periphery region of the first main side of the semiconductor die. A corresponding method of manufacture is also provided.

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

A transfer head array includes a base substrate, an interlayer isolation layer, plural transfer heads, and at least one shielding layer. The interlayer isolation layer is disposed on the base substrate, and the interlayer isolation layer has a flat top surface facing away from the base substrate. The transfer heads are arranged on the interlayer isolation layer. The shielding layer is disposed in the interlayer isolation layer.

A three-dimensional (3D) untethered mobile actuator having the following parts: (a) a substrate having two or more magnetized panels, and (b) a frame that connects the magnetized panels, the magnetized panels being made of a polymer with embedded permanent magnetic particles, each magnetized panel of the 3D untethered mobile actuator having a magnetic moment in a different direction than a next neighboring panel, and the 3D untethered mobile actuator having a structural configuration that changes between a substantially flat structural configuration in the absence of a magnetic field, and an actuated structural configuration when under influence of a magnetic field. Methods of manufacturing and using the 3D mobile actuator and a system that includes the 3D mobile actuator are provided.

Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

A system and method form charge patterns on micro objects. The system and method employ a micro object including a rectifying device. The rectifying device exhibits an asymmetric current-voltage (I-V) response curve. Further, the system and method employ a device external to the micro object to induce the flow of charge through the rectifying device.

A magnetic pick and place probe includes an outer sheath, an inner sheath to vertically slide within the outer sheath, None or more sheath magnets attached to a bottom end of the inner sheath and a tip positioned at a bottom end of the outer sheath to simultaneously pick up an array of magnets for placement on a substrate.

A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moir? alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

System and method that allow to jointly cause movement of multiple micro-and-nano-objects to desired positions are described. A high speed camera tracks the locations of the objects. An array of electrodes is used to generate a dynamic potential energy landscape for manipulating objects with both DEP and EP forces. One or more computing devices are used to: process images captured by the camera to estimate positions of the objects; use model predictive control optimization to obtain trajectories and electrode potentials for moving at least some of the objects from estimated positions to further positions; and control the electrodes based on electrode potentials.

A micro assembly having a substrate and an operating plane coupled to the substrate. The operating plane is movable from an in-plane position to an out-of-plane position. One or more electric connections provide electric power from the substrate to the operating plane in the out-of-plane position. A tool is coupled to the operating plane. The tool is operable to receive electric power from the operating plane to perform work.