B81C99/0025

ADHESIVE TAPE SEPARATING TOOL, MANUFACTURING APPARATUS OF SEMICONDUCTOR CHIP, MANUFACTURING APPARATUS OF MEMS DEVICE MANUFACTURING APPARATUS OF LIQUID EJECTING HEAD, AND SEPARATING METHOD OF ADHESIVE TAPE
20180090351 · 2018-03-29 ·

Provided is an adhesive tape separating tool which separates adhesive tape bonded to one face of a work which includes an opening on the one face from the work, in which a protrusion portion forming region in which a plurality of protrusion portions are formed is provided on a face on a side which comes into contact with the work in the tape separating tool, and the protrusion portion forming region is disposed at a position separated from a position facing the opening on the one face of the work.

Inertial angular sensor of balanced MEMS type and method for balancing such a sensor
09869551 · 2018-01-16 · ·

An inertial angular sensor of MEMS type has a support of at least two masses which are mounted movably with respect to the support, at least one electrostatic actuator and at least one electrostatic detector. The masses are suspended in a frame itself connected by suspension means to the support. The actuator and the detector are designed to respectively produce and detect a vibration of the masses, and a method for balancing such a sensor provided with at least one load detector mounted between the frame and the support and with at least one electrostatic spring placed between the frame and one of the masses and slaved so as to ensure dynamic balancing of the sensor as a function of a measurement signal of the load sensor.

DEVICE MANUFACTURING METHOD AND DEVICE MANUFACTURING APPARATUS
20180005906 · 2018-01-04 ·

The device manufacturing method includes a length measuring step (S5) of, on the basis of an observation target image of an SEM image taken from a direction having a predetermined angle from a direction perpendicular to a plane of a substrate, measuring the thickness of a target object, or the depth of etching, formed on the substrate. In addition, in the length measuring step, an etching angle made by a cross section of the etching and the direction perpendicular to the plane of the substrate is calculated from processing data of the target object, and the thickness of the target object or the depth of the etching is measured on the basis of the calculated etching angle.

Additive manufacturing processes and manufactured article

An additive manufacturing process includes forming an object material stack using sheet materials without use of binder material between the sheet materials and forming features of the cross-sectional layers of a 3D object in the corresponding sheet materials. Another process involves forming features of the cross-sectional layers of a 3D object in soot layers of a laminated soot sheet. A manufactured article includes three or more glass layers laminated together without any binder material between the glass layers. At least one of the glass layers is composed of silica or doped silica, and at least one feature is formed in at least one of the glass layers.

Room temperature bonding apparatus and room temperature bonding method

A room temperature bonding apparatus includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently from the first beam source, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism bonds between the first substrate and the second substrate by contacting between the first surface and the second surface after the first surface is irradiated with the first activation beam and the second surface is irradiated with the second activation beam. Thus, a plurality of the substrates made of different materials is appropriately bonded.

Process and apparatus for the preparation of a bonded substrate

The present invention relates to a process and apparatus for the preparation of a bonded substrate. More particularly, the present invention relates to a PDMS bonding apparatus. More specifically, the present invention relates to a PDMS bonding apparatus which uses plasma to bond PDMS to a substrate. The present invention discloses a PDMS bonding apparatus and process for using said apparatus, the apparatus comprising: a process chamber (100) forming a sealed processing space (S) for bonding of PDMS (polydimethylsiloxane); a first support (200) installed in the process chamber (100) and which supports the PDMS (1); a second support (300) installed in the process chamber (100) opposing the first support (200) and which supports a bonding object (2) which is bonded to the PDMS (1); a gas injection unit (400) which ejects process gas between the first support (200) and the second support (300), and; a plasma generator (500) which creates a plasma atmosphere within the process chamber (100).

Deposition apparatus

A magnetron sputtering apparatus for depositing material onto a substrate, comprises: a chamber comprising a substrate support and a target; a plasma production device configured to produce a plasma within the chamber suitable for sputtering material from the target onto the substrate; and a thermally conductive grid comprising a plurality of cells. Each cell comprises an aperture and the ratio of the height of the cells to the width of the apertures is less than 1.0. The grid is disposed between the substrate support and the target and is substantially parallel to the target. The upper surface of the substrate support is positioned at a distance of 75 mm or less from the lower surface of the target.