A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

A method for a MEMS device comprises determining in a computer system, a first driving signal for the MEMS device in response to a first time delay and to a base driving signal, applying the first driving signal to the MEMS device to induce the MEMS device to operate at a first frequency, determining a second driving signal for the MEMS device in response to a second time delay and to the base driving signal, applying the second driving signal to the MEMS device to induce the MEMS device to operate at a second frequency, determining a first quality factor associated with the MEMS device in response to the first frequency and the second frequency, determining a quality factor associated with the MEMS device in response to the first quality factor, and determining whether the quality factor associated with the MEMS device, exceeds a threshold quality factor.

A circuit board module for a sound transducer assembly for generating and/or detecting sound waves in the audible wavelength spectrum includes a circuit board, which features a recess with a first opening. At least a part of a MEMS sound transducer is arranged in the area of the first opening, such that the recess at least partially forms a cavity of the MEMS sound transducer. The recess features a second opening opposite to the first opening, such that the recess extends completely through the circuit board. A sound transducer assembly includes such a circuit board.

A micromechanical resonator is disclosed. The resonator includes a resonant micromechanical element. A film of annealable material deposited on a facial surface of the element. In one instance, the resonance of the element can be adjusting by using a feedback loop to control annealing of the deposited film.

According to an embodiment, a micro-fabricated test structure includes a structure mechanically coupled between two rigid anchors and disposed above a substrate. The structure is released from the substrate and includes a test layer mechanically coupled between the two rigid anchors. The test layer includes a first region having a first cross-sectional area and a constricted region having a second cross-sectional area smaller than the first cross-sectional area. The structure also includes a first tensile stressed layer disposed on a surface of the test layer adjacent the first region.

A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

A production method for a detection apparatus includes: forming at least one sensitive region having at least one exposed sensing area on and/or in a semiconductor substrate, encapsulating at least one part of the semiconductor substrate so that the at least one sensing area is sealed in an air-, liquid- and/or particle-tight fashion from an external environment, and forming at least one opening so that at least one air, liquid and/or particle access from the external environment to the at least one sensing area is created, wherein before forming the at least one opening, at least one first test and/or calibration measurement is performed, for which at least one sensor signal of the at least one sensitive region having the at least one sensing area sealed in an air-, liquid- and/or particle-tight fashion is determined as at least one first test and/or calibration signal. Also described are related detection apparatuses.

A MEMS transducer, for instance a MEMS capacitive transducer, comprising: a flexible membrane, the flexible membrane comprising a conductive track; and a continuity testing circuit electrically connected to the conductive track. The conductive track may be electrically isolated from any further conductive regions of the flexible membrane. The continuity testing circuit is configured to test the continuity of the conductive track.

The invention relates to a circuit board module (2) for a sound transducer assembly (1) for generating and/or detecting sound waves in the audible wavelength spectrum, with a circuit board (4), which features a recess (6) with a first opening (7), and at least a part of a MEMS sound transducer (5), which is arranged in the area of the first opening (7), such that the recess (6) at least partially forms a cavity (9) of the MEMS sound transducer (5). In accordance with the invention, the recess (6) features a second opening (8) opposite to the first opening (7), such that the recess (6) extends completely through the circuit board (4). In addition, the invention relates to a sound transducer assembly (1) with such a circuit board module (2) along with a method for manufacturing such sound transducer assembly (1).

A system includes three related structures. A first structure includes a first finger interposed between a first pair of sidewalls. The first finger has a first length and a first width, and is separated from each of the sidewalls by a first gap having a first spacing. A second structure includes a second finger interposed between a second pair of sidewalls. The second finger has a second length and the first width, and is separated from each of the sidewalls by a second gap having a second spacing. A third structure includes a third finger interposed between a third pair of sidewalls. The third finger has the second length and a second width, and is separated from each of the sidewalls by a third gap having a second spacing. Resistance and capacitance measurements of the three structures are used to extract critical parameters resulting from a semiconductor device fabrication process.