In some embodiments, a sensor includes a microelectromechanical system (MEMS) structure, a cover, and a bump stop. The MEMS structure is configured to move responsive to electromechanical stimuli. The cover is positioned on the MEMS structure. The cover is configured to mechanically protect the MEMS structure. The bump stop is disposed on a substrate and the bump stop is configured to stop the MEMS structure from moving beyond a certain point. The bump stop is further configured to stop the MEMS structure from making physical contact with the substrate. Moreover, the cover is configured to apply a force to the MEMS structure responsive to a voltage being applied to the cover.

A method is provided for checking a sensor value of a MEMS sensor. In the process, an output signal of the MEMS sensor is detected and the sensor value is ascertained as a function of the output signal. In addition, frequency components of the output signal are examined and a determination is made as to whether the ascertained sensor value is reliable or unreliable as a function of the examination of the frequency components. If the sensor value is determined to be unreliable, the sensor value is discarded or provided with a lower weighting, or a warning it output relating to the unreliability of the sensor value or an item of information about the unreliability of the sensor value is stored.

A method for measuring a behavior of a MEMS device is disclosed. In an embodiment a method includes mounting the MEMS device to a testing apparatus that comprises a vibration source, wherein the MEMS device comprises a 6-axis or 9-axis inertial sensor, applying a vibration to the MEMS device by the vibration source and simultaneously moving the testing apparatus according to a predefined movement pattern, reading output data provided by the inertial sensor and comparing the output data to the predefined movement pattern and/or reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.

A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

A microelectromechanical system (MEMS) sensor testing device, system and method are provided. The testing device includes a socket having a plurality of pads configured to receive a respective plurality of pins of the MEMS sensor, a body having a plurality of operable positions associated with a respective plurality of orientations of the MEMS sensor and circuitry which performs a method for testing the MEMS sensor in the plurality of operable positions. The method includes, for each position of the plurality of operable positions, outputting an indication of the position to the plurality of operable positions, receiving one or more measurements made by the MEMS sensor at the respective position and determining whether the one or more measurements satisfy a reliability criterion. The method includes generating a report based on the plurality of measurements and indicating whether the plurality of measurements satisfy a plurality of reliability criteria, respectively.

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.

A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.

A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device.

Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.