A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.

Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.

A micro fabricated sensor for micro-mechanical and nano-mechanical testing and nano-indentation. The sensor includes a force sensing capacitive comb drive for the sensing of a force applied to a sample, a position sensing capacitive comb drive for the sensing of the position of a sample and a micro fabricated actuator to apply a load to the sample. All the sensor components mentioned above are monolithically integrated on the same silicon MEMS chip.

A test circuit structure for determining a resonant frequency of the beam of a micro-electrical-mechanical-system (MEMS) switch includes the MEMS switch having a gate electrode, a switch contact, and the beam. The test circuit structure further includes a voltage supply configured to sequentially produce (i) a switch-close voltage configured to bring the beam in contact with the switch contact, and (ii) a non-zero switch-open voltage configured to release the beam from contact with the switch contact and produce an oscillating current. The test circuit structure further includes a waveform capture device configured to determine the resonant frequency of the beam by an analysis of a waveform produced by the oscillating current upon release of the beam. The waveform generator produces a high voltage to supply the switch-close voltage and produces a low voltage to supply the switch-open voltage.

A drop test device for a micromechanical component. The drop test device includes a drop body having a shell and having an interior space for receiving at least one micromechanical component.