B81C2201/034

Method of manufacturing laminate
12122669 · 2024-10-22 · ·

A manufacturing method capable of manufacturing a laminate including a substrate having a recess and a film with a high yield is provided. The method of manufacturing a laminate of the present invention includes: preparing a substrate having a recess; disposing a film on the substrate so as to cover the recess; and obtaining a laminate by thermocompression bonding between the film and the substrate by pressing the film and the substrate with a first elastic body and a second elastic body in a state in which the substrate on which the film is disposed is disposed between the first elastic body and the second elastic body such that the film is on the first elastic body side, in which the first elastic body is harder than the second elastic body.

LARGE SCALE INTEGRATION OF HAPTIC DEVICES
20180179051 · 2018-06-28 ·

A method for large scale integration of haptic devices is described. The method comprises forming a first elastomer layer of a large scale integration (LSI) device on a substrate according to a specified manufacturing process, the first elastomer layer having a plurality of fluid based circuits, the first elastomer layer adhering to a plurality of formation specifications. The method further comprises curing the first elastomer layer. Additionally, one or more additional elastomer layers of the LSI device are formed with the first elastomer layer according to the specified manufacturing process, the one or more additional elastomer layers having a plurality of fluid based circuits, the one or more additional elastomer layers adhering to the plurality of formation specifications.

Method of manufacturing semiconductor device with glass pieces

A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material. A cavity is formed in the working surface. The source material is pressed against the mold substrate. During pressing a temperature of the source material and a force exerted on the source material are controlled to fluidify source material. The fluidified source material flows into the cavity. Re-solidified source material forms a glass piece with a protrusion extending into the cavity. After re-solidifying, the glass piece may be bonded to the mold substrate. On the glass piece, protrusions and cavities can be formed with slope angles less than 80 degrees, with different slope angles, with different depths and widths of 10 micrometers and more.

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURING A MEMS DEVICE
20240409398 · 2024-12-12 ·

A MEMS device is provided that includes a cap layer and a device layer. The cap layer includes a cap wafer made of electrically insulating material, and the device layer includes at least one seismic element. Moreover, the cap layer includes at least one silicon-filled portion at a first face of the cap layer facing the device layer, and at least one of said at least one silicon-filled portion includes a gap that locally increases distance from the cap layer to the at least one seismic element in the device layer.

Microfluidic devices and associated methods

A microfluidic device includes a microfluidic channel formed in the microfluidic device and defined by a floor and a ceiling positioned vertically above the floor, wherein the microfluidic channel includes at least one fluid inlet configured to receive a fluid flow and at least one fluid outlet, and wherein at least one of the ceiling and the floor of the microfluidic channel is sloped relative to a horizontal plane.

CONFORMABLE PATCH PUMP
20170232189 · 2017-08-17 ·

A flexible patch pump for controllable accurate subcutaneous delivery of one or more medicaments to a patient includes a laminated layered structure. The pump may have a rigid reservoir layer including a number of rigid reservoirs disposed in a flexible material; a flexible microfluidic layer including a compliant membrane for sealing the rigid reservoirs, a network of microfluidic channels connecting the rigid reservoirs, and a number of inlet and/or outlet valves corresponding to the rigid reservoirs; and a flexible-rigid electronic circuit layer including a number of individually-addressable actuators. In operation, the rigid reservoirs may contain medicament that is dispensed in precise volumes at appropriate times due, for to example, to a pressure change in an addressed reservoir caused by displacement of the compliant membrane or other actuation element.

Conformable patch pump
09616171 · 2017-04-11 · ·

A flexible patch pump for controllable accurate subcutaneous delivery of one or more medicaments to a patient includes a laminated layered structure. The pump may have a rigid reservoir layer including a number of rigid reservoirs disposed in a flexible material; a flexible microfluidic layer including a compliant membrane for sealing the rigid reservoirs, a network of microfluidic channels connecting the rigid reservoirs, and a number of inlet and/or outlet valves corresponding to the rigid reservoirs; and a flexible-rigid electronic circuit layer including a number of individually-addressable actuators. In operation, the rigid reservoirs may contain medicament that is dispensed in precise volumes at appropriate times due, for example, to a pressure change in an addressed reservoir caused by displacement of the compliant membrane or other actuation element.

METHOD FOR MANUFACTURING A MICROMECHANICAL TIMEPIECE PART AND SAID MICROMECHANICAL TIMEPIECE PART
20170068215 · 2017-03-09 · ·

A method for manufacturing a micromechanical timepiece part starting from a silicon-based substrate, including, forming pores on the surface of at least one part of a surface of said silicon-based substrate of a determined depth, entirely filling the pores with a material chosen from diamond, diamond-like carbon, silicon oxide, silicon nitride, ceramics, polymers and mixtures thereof, in order to form, in the pores, a layer of the material of a thickness at least equal to the depth of the pores. A micromechanical timepiece part including a silicon-based substrate which has, on the surface of at least one part of a surface of the silicon-based substrate, pores of a determined depth, the pores being filled entirely with a layer of a material chosen from diamond, diamond-like carbon, silicon oxide, silicon nitride, ceramics, polymers and mixtures thereof, of a thickness at least equal to the depth of the pores.

MICROFLUIDIC DEVICES AND ASSOCIATED METHODS

A microfluidic device includes a microfluidic channel formed in the microfluidic device and defined by a floor and a ceiling positioned vertically above the floor, wherein the microfluidic channel includes at least one fluid inlet configured to receive a fluid flow and at least one fluid outlet, and wherein at least one of the ceiling and the floor of the microfluidic channel is sloped relative to a horizontal plane.