A method of producing a semiconductor component having at least one exposed membrane section. A semiconductor material is provided having a carrier substrate provided with a passivation layer, where there is a membrane ply which is disposed atop the passivation layer and includes a material which is variable by water, in particular hydrolyzable, where the membrane ply is covered by a protective layer on an opposite side from the passivation layer. A portion of the carrier substrate is removed using a wet-chemical method in order to obtain an exposed region of the passivation layer in a structured region of the semiconductor material. A section of the membrane ply is exposed in the structured region by means of a first dry etching step for etching of the passivation layer and a second dry etching step for etching of the protective layer, in order to obtain the exposed membrane section.

A method for producing a MEMS mirror array such as can be used, e.g. in photolithography, and a corresponding MEMS mirror array, can reduce issues possibly resulting from environmental influences.

In a method of post-processing MEMS chips comprising MEMS structures arranged on a carrier material and having at least one projection region of projecting material protruding laterally beyond the region of the MEMS chip provided with MEMS structures, at least one projection region is removed by separating the projecting material from the carrier material of the MEMS chip. For handling MEMS chips without regions projecting beyond the MEMS structures arranged on a carrier material, for example after post-processing according to the disclosure has been carried out, at least one lateral depression is provided in the carrier material and the MEMS chips are handled by way of a tool engaging in the lateral depression(s).