A slurry handling apparatus includes at least one reception hopper includes a base, a rear wall and opposing side walls, and an opening provided in the base. Slurry delivered into the reception hopper from a tanker can pass through the opening in the base, and a respective first dewatering screen having an apertured screening deck is located beneath the at least one reception hopper so that slurry passing through the opening is delivered onto the deck of the respective screen, with undersize material and water passing through the apertures of the deck to be received within a sump, and with oversize material passing over the deck to be discharged from a downstream end of the deck.

A slurry handling apparatus includes at least one reception hopper includes a base, a rear wall and opposing side walls, and an opening provided in the base. Slurry delivered into the reception hopper from a tanker can pass through the opening in the base, and a respective first dewatering screen having an apertured screening deck is located beneath the at least one reception hopper so that slurry passing through the opening is delivered onto the deck of the respective screen, with undersize material and water passing through the apertures of the deck to be received within a sump, and with oversize material passing over the deck to be discharged from a downstream end of the deck.

A slurry handling apparatus includes at least one reception hopper includes a base, a rear wall and opposing side walls, and an opening provided in the base. Slurry delivered into the reception hopper from a tanker can pass through the opening in the base, and a respective first dewatering screen having an apertured screening deck is located beneath the at least one reception hopper so that slurry passing through the opening is delivered onto the deck of the respective screen, with undersize material and water passing through the apertures of the deck to be received within a sump, and with oversize material passing over the deck to be discharged from a downstream end of the deck.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

A pulverizing dry-washer includes a frame, an upper feeder, a bi-directional pulverizing box, a recovery unit, and a counterweight fan assembly. The upper feeder is angularly attached to an upper end of the frame so that the ore can be screened and discharged into the bi-directional pulverizing box that is positioned below the upper feeder. The bi-directional pulverizing box is mounted onto the recovery unit to further to screen the ore that receives from the upper feeder. A riffle board within the recovery unit is then able to trap precious metal while clay/sedimentary material are discharged through the end of the recovery unit. The counterweight fan assembly is mounted within the recovery unit. An air flow is introduced into the recovery unit via the counterweight fan assembly so that the recovery unit and the bi-directional pulverizing box can be vibrated to separate the precious metal from clay/sedimentary material.

A pulverizing dry-washer includes a frame, an upper feeder, a bi-directional pulverizing box, a recovery unit, and a counterweight fan assembly. The upper feeder is angularly attached to an upper end of the frame so that the ore can be screened and discharged into the bi-directional pulverizing box that is positioned below the upper feeder. The bi-directional pulverizing box is mounted onto the recovery unit to further to screen the ore that receives from the upper feeder. A riffle board within the recovery unit is then able to trap precious metal while clay/sedimentary material are discharged through the end of the recovery unit. The counterweight fan assembly is mounted within the recovery unit. An air flow is introduced into the recovery unit via the counterweight fan assembly so that the recovery unit and the bi-directional pulverizing box can be vibrated to separate the precious metal from clay/sedimentary material.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.