An applicator for dispensing multiple adhesives on a substrate is disclosed. The applicator includes a manifold that includes a first dispensing module and a second dispensing module. The first dispensing module has a first inlet and a first nozzle. The first inlet receives a first adhesive and the first nozzle applies the first adhesive to the substrate. The second dispensing module is adjacent the first dispensing module and has a second inlet and a second nozzle. The second inlet receives a second adhesive that is different from the first adhesive. The second nozzle applies the second adhesive to the substrate.

There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.

The present disclosure relates to a slot die coating apparatus for coating an electrode collector with an electrode active material slurry. The slot die coating apparatus includes a coating roller; a slot die comprising a slurry receiving part and a discharge opening configured to discharge the electrode active material slurry in an opposite direction on which gravity acts; an air vent installed in the slot die so that it is directly connected to a point at which the slurry receiving part and the discharge opening connect.

A substrate processing apparatus includes a nozzle block in which a slit-like discharge port is formed and a controller. The controller controls an X-direction driver and a Z-direction driver, so that a nozzle block is moved on a substrate with a gap between the nozzle block and the substrate filled with a processing liquid. At this time, the processing liquid is applied onto the substrate. Thereafter, the nozzle block is separated from the substrate, so that a liquid column connecting the nozzle block to the substrate is formed. The nozzle block is moved such that the liquid column changes from a liquid contact state in which the liquid column is in contact with the processing liquid present in a discharge port to a non-contact state in which the liquid column is not in contact with the processing present in the discharge port.

An adhesive dispenser having a pump and a slotted nozzle assembly is disclosed. The pump includes a pump body assembly having a nozzle body defining a recess that extends into the body, and a fluid channel with an inlet to receive adhesive and an outlet open to the recess. The pump includes a valve member movably disposed in the fluid channel and configured to selectively block the adhesive from flowing to the outlet. The slotted nozzle assembly includes a baffle plate having a slot that extends through the plate and a cover plate attached to the plate. The slotted nozzle assembly is received in the recess of the nozzle body, such that an input channel extending from the outlet of the body to the slot is defined between the baffle plate and the nozzle body, and an output channel extending from the slot to a dispensing outlet is defined between the baffle plate and the cover plate.

A coating device has: a die head that is provided with a supply port into which a coating slurry is supplied, a manifold that stores the coating slurry, and a slit that dispenses the coating slurry; a supply pipe that is connected to the supply port of the die head; and a cover plate that is provided in the supply port or the supply pipe and that reduces the flow rate of the coating slurry at the center of a cross-section that is orthogonal to the direction in which the coating slurry in the supply port or the supply pipe flows into the die head.

An ejection device includes a nozzle that ejects an ejection fluid, an ejection-side pump, a driving-side pump, and a heating unit. The ejection-side pump includes a pressure transmitting member, and an ejection chamber and a driving chamber adjacent to each other across the pressure transmitting member. The ejection chamber is filled with the ejection fluid. The driving chamber is filled with a driving fluid. The driving-side pump is a pump that applies pressure to the driving fluid. The pressure transmitting member transmits the pressure applied to the driving fluid to the ejection fluid in the ejection chamber. The heating unit heats at least the ejection-side pump while the driving-side pump remains unheated.

This coating device according to the present invention comprises a slit nozzle (30); a liquid supply path (10) for a coating liquid; a pneumatic transportation device (20) for transporting the coating liquid pneumatically; a liquid supply valve (50) for opening/shutting the liquid supply path (10); a pump (40) configured so as to be capable of suctioning the coating liquid inside the slit nozzle (30); a residual-pressure removal means (80) for removing the residual pressure inside the slit nozzle (30); and a control section (70) for controlling the operation of the liquid supply valve (50), the pump (40), and the residual-pressure removal means (80); wherein the coating liquid remaining inside the slit nozzle (30) is suctioned at the end of coating after pumping of the coating liquid is stopped and the residual pressure inside the slit nozzle (30) is removed. With this configuration the coating device improves responsive at the end of the coating without a complicated control procedure.

Methods and apparatuses herein provide for the application of viscous fluids, such as adhesives, in pre-determined patterns, to an advancing substrate. The fluid applicator comprises a slot die applicator and a substrate carrier. The slot die applicator comprises a plurality of applicator channels, each applicator channel being controlled by a switching valve, and wherein the switching valves are independently switchable.

An applicator for dispensing adhesive and a method of diverting flow in an applicator are disclosed. The applicator includes a plurality of pump assemblies each having an inlet and an outlet, a plurality of dispensing modules each having an inlet, and a flow diverter plate in fluid communication with the plurality of pump assemblies. The flow diverter plate defines a body having a first surface in fluid communication with the plurality of pump assemblies, a second surface opposite the first surface in fluid communication with the plurality of dispensing modules, and a plurality of diverter passages extending from the first surface to the second surface. Each of the plurality of diverter passages has a first opening on the first surface and a second opening on the second surface, and the first opening is in fluid communication with the outlet of one of the plurality of pump assemblies, and the second opening is in fluid communication with the inlet of at least one of the plurality of dispensing modules.