A tool useful in the manufacture of a semiconductor is disclosed. A mold is providing having an interior defining a planar capillary space. A coating substantially covers at least the planar capillary space of the graphite member. The coating is substantially non-reactive to silicon at temperatures greater than approximately 1420 degrees Centigrade.

A substrate processing method includes a coating step that applies a coating liquid to a substrate having a front surface on which a pattern is formed, thereby forming a coating film on the substrate, a film removing step that heats the substrate to gasify components of the coating film thereby to reduce a thickness of the film, and a film curing step that is performed after or simultaneously with the film removing step and that heats the substrate to cure the coating film through crosslinking reaction. The film removing step is performed under conditions ensuring that an average thickness of the cured coating film is not greater than 80% of an average thickness of the coating film before being subjected to the film removing step.

A modular electric induction heating and coating apparatus and method for coating, heating and/or coating and heating (and vice versa) the exterior surface of a pipe section within a pipe treatment region is provided. The apparatus comprises an interchangeable central main frame assembly removably attached to an outer drive frame assembly on each side of the central main frame assembly. An interchangeable induction coil assembly can be mounted in a coil main frame assembly of the central main frame assembly. The coil main frame assembly can close around a pipe section for electric induction heating of the pipe section within the pipe treatment region via a driver system in a central top drive frame assembly. The outer drive frame assemblies include mounting and rotational drive assemblies for interchangeable coating head cartridges that can coat the section of the pipe in the pipe treatment region.