Patent classifications
B05D3/108
Method of semiconductor device fabrication having application of material with cross-linkable component
Provided is a material composition and method for that includes providing a primer material including a surface interaction enhancement component, and a cross-linkable component. A cross-linking process is performed on the deposited primer material. The cross-linkable component self-cross-links in response to the cross-linking process to form a cross-linked primer material. The cross-lined primer material can protect an underlying layer while performing at least one process on the cross-linked primer material.
METHOD FOR APPLYING A POWDER COATING
A method for the application of at least two different powder coating layers to a substrate comprising the steps of application of a first powder coating layer followed by the application of a second powder coating layer, without any substantial curing of the first powder coating layer prior to the application of the second powder coating layer, followed by the simultaneous curing at a temperature and time period sufficient to substantially cure the first powder coating layer and the second powder coating layer, wherein the first powder coating layer and the second powder coating layer each comprise at least one resin independently having at least one functional group in stoichiometric ratios sufficient to react or crosslink with the other layer at the interface of the two or more layers.
WEARABLE COOLING SYSTEM FOR BODY COOLING AND METHOD FOR FABRICATING THE WEARABLE COOLING SYSTEM
One variation of a system includes a garment insert: configured to be worn across a dermal surface; including a textile panel defining a grid receptacle; and including a grid structure arranged within the grid receptacle and defining an array of apertures. The system further includes a cooling unit including a heatsink structure: defining a base section defining an inner surface configured to contact the dermal surface; and defining a set of heatsink columns extending from the base section, opposite the inner surface, and configured to seat extending through the array of apertures. The cooling unit: is configured to wick moisture from the dermal surface toward surfaces of the set of heatsink columns; and includes a polymer frame, bonded to the heatsink structure about the base section, configured to abut surfaces of the base section to surfaces of the grid receptacle to flexibly retain the cooling unit within the grid receptacle.
WOOD TREATMENT METHOD
Disclosed is a method for treating a grained material. A nonlimiting example of the method includes the operations of providing a workpiece having grains, exasperating a surface of the workpiece to open the grains, applying at least one coat of a base paint to the exasperated surface, applying at least one layer of clear coat on the base paint, applying at least one of a glaze and a paint on the clear coat, and surface treating to reveal grains of the workpiece. Disclosed also are items of furniture and sheet materials treated by the aforementioned process.
Low volatility, high efficiency gas barrier coating for cryo-compressed hydrogen tanks
A bilayer object consisting of a carbon fiber reinforced polymer substrate coated with a composition of matter comprising horizontally aligned exfoliated graphene sheets dispersed in an epoxy binder. A method includes depositing graphene into a hardener, mixing the hardener and the graphene to produce a homogenous composite mixture, adding a resin material to the composite mixture to produce an epoxy graphene material, coating a structure with the epoxy graphene material, aligning the graphene sheets in the in-plane orientation, and curing the epoxy graphene material.
METHOD OF SEMICONDUCTOR DEVICE FABRICATION HAVING APPLICATION OF MATERIAL WITH CROSS-LINKABLE COMPONENT
Provided is a material composition and method for that includes providing a primer material including a surface interaction enhancement component, and a cross-linkable component. A cross-linking process is performed on the deposited primer material. The cross-linkable component self-cross-links in response to the cross-linking process to form a cross-linked primer material. The cross-lined primer material can protect an underlying layer while performing at least one process on the cross-linked primer material.
Robust interface bonding with B-staged thermoplastic polyimide adhesive
Thermoplastic Polyimide (TPI) polymer adhesive coated laminating films in which the TPI coating is under cured or B-staged as well as the process for preparing the films and the use thereof is disclosed.
Intumescent coating composition
A liquid intumescent coating composition comprising the following components: (a) 25.0-75.0 volume % of one or more organic thermosetting polymer(s) and one or more curing agent(s) for the organic thermosetting polymer(s), (b) 1.0-70.0 volume % of a source of phosphoric or sulphonic acid, (c) 6.0-60.0 volume % of a source of boric acid, (d) 0-2.0 volume % of melamine or melamine derivatives, (e) 0-1.0 volume % of one or more isocyanurate derivatives, wherein the volume % of components (a), (b), (c), (d) and (e) is calculated on the total volume of the non volatile components in the coating composition. The thermosetting intumescent coating composition is suitable for protecting substrates against hydrocarbon fires, for example jet fires. The coating composition can be used without a supporting mesh. The present invention also relates to substrates coated the intumescent coating composition, and a method of protecting structures from fire.
Impregnation of a non-conductive material with an intrinsically conductive polymer through in-situ polymerization
Composite materials are made by impregnating a non-conductive material with a conducting monomer to form a monomer-impregnated non-conductive material, and polymerizing the monomer-impregnated non-conductive material to form the composite material. The composite materials are used in medical devices and implants.
Ceramic matrix composite articles and methods for forming same
A method for forming a ceramic matrix composite article includes forming by melt infiltration a ceramic matrix composite substrate inducing a ceramic fiber reinforcement material in a ceramic matrix material having a free silicon proportion and forming by chemical vapor infiltration a ceramic matrix composite outer layer including a ceramic fiber reinforcement material in a ceramic matrix material having no free silicon proportion disposed on at least a portion of the substrate.