In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink (1) contains a copper oxide (2), a dispersant (3), and a reducing agent. The content of the reducing agent is in the range of formula (1), and the content of the dispersant is in the range of formula (2). (1) 0.00010(reducing agent mass/copper oxide mass)0.10 (2) 0.0050(dispersant mass/copper oxide mass)0.30 The reducing agent content promotes the reduction of copper oxide to copper during firing, and promotes the sintering of copper.

Provided herein is a film and methods of producing the same. The film includes a substrate and a layer adjacent to the substrate, wherein a surface of the layer comprises spaced apart protrusions. The methods include providing a substrate, depositing a layer on at least a portion of the substrate, decomposing the layer to form at least a first phase of material and a second phase of material, and removing at least a portion of the second phase from the decomposed layer to form a structured layer.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

A method of manufacturing a layer containing quantum dots, the layer including first regions where the quantum dots are active and second regions where the quantum dots are inactive, the method including: a) depositing on a support a first layer of a matrix containing quantum dots; b) depositing on the first layer a second resist layer; c) exposing the second layer to light through a mask delimiting the first and second regions, and then developing the resin of the second layer to remove the resin of the second layer opposite the second regions while keeping it opposite the first regions; and d) removing the resin of the second layer opposite the first regions without removing the first layer.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

A medical stent may include a tubular support structure including a plurality of struts defining a plurality of cells disposed between the plurality of struts. A polymeric coating may be disposed over the tubular support structure such that a first portion of the plurality of cells are closed by the polymeric coating in a first region of the tubular support structure and a second portion of the plurality of cells in a second region of the tubular support structure remain open to fluid flow and/or tissue ingrowth therethrough. The struts in the first region of the tubular support structure and the struts in the second region of the tubular support structure may be at least partially covered by the polymeric coating.

A method of applying a coating to a device which has one or more components housed in a housing. A liquid coating precursor is applied to at least part of the internal surface of the housing and/or at least part of the one or more components within the housing. Low pressure conditions are applied to the closed housing, sufficient to cause the liquid coating precursor to evaporate and initiation of the liquid coating precursor to thereby cause the coating to form on at least some of the internal surfaces of the device.

A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

A method of decreasing a water contact angle and/or increasing a surface energy of a liquid is disclosed herein, the method comprising exposing the liquid to a plasma treatment. Further disclosed is a plasma-treated liquid exhibiting a decreased water contact angle and/or increased surface energy, compared to the water contact angle and/or surface energy, respectively, of a non-treated corresponding liquid. Methods for combining a first liquid and a second liquid, or for enhancing an adhesion between a liquid and a surface of another substance, the methods comprising exposing a liquid to plasma treatment, are further disclose herein, as well as a method of predicting an apparent contact angle of a liquid droplet on a surface of a substance.

A method of producing a polymer part comprising the following steps: (a) incorporating a hydrophobic small molecule into the polymer before, during or after manufacture of the polymer part, the hydrophobic small molecule and the polymer being essentially inert to one another; and (b) annealing the polymer part to induce migration of the hydrophobic small molecules to a surface of the polymer part to provide that surface with a specified degree of hydrophobicity defined by the combination of the polymer and the hydrophobic small molecule; is described. Polymer parts made according to the method are also described.