A liquid-repellent plastic molded body 1 according to the present invention has a liquid-repellent surface. The liquid-repellent surface has a re-entrant structure surface formed by an array of pillars 20 each having a head portion 20a with an enlarged diameter. At least a part of the re-entrant structure surface has a fluorine-containing surface in which fluorine atoms are distributed.

A method for growing a transparent conductive metal layer on a substrate is disclosed. The method includes the steps of applying crystal growth ink to a surface of the substrate, wherein the crystal growth ink includes a metal ionic precursor; and exposing the substrate to plasma irradiation to cause the growing of a crystalline metal framework on the substrate, wherein the exposure is based on a set of predefined exposure parameters.

Plasma systems for depositing biomolecules, pharmaceutical agents, and other therapeutic active agents onto surfaces are described. The systems may include a plasma device having one or more electrodes, a gas supply inlet, a plasma outlet exposed to ambient pressure, and an ignition system operatively connected to the electrodes for providing a non-thermal equilibrium plasma within the plasma chamber. A particulate delivery system may be used to introduce the active agent(s) as a dry powder into or downstream of the plasma, and to deposit the plasma-treated active agent(s) to produce a coating on a surface. The coating may retain the activity of the active agent(s).

Embodiments relate to surface treating a substrate, spraying precursor onto the substrate using supercritical carrier fluid, and post-treating the substrate sprayed with the precursor to form a layer with nanometer thickness of material on the substrate. A spraying assembly for spraying the precursor includes one or more spraying modules and one or more radical injectors at one or more sides of the spraying module. A differential spread mechanism is provided between the spraying module and the radical injectors to inject spread gas that isolates the sprayed precursor and radicals generated by the radical injectors. As relative movement between the substrate and the spraying assembly is made, portions of the substrate is exposed to first radicals, sprayed with precursors either one of the spraying modules or both spraying modules using supercritical carrier fluid, and then exposed to second radicals again.

Embodiments relate to forming a thin film of nanoscale thickness by depositing a mixture of a precursor and a supercritical fluid onto a surface of a substrate and removing the supercritical fluid from the surface of the substrate. The mixture is sprayed onto the surface by a spraying module. A layer of the precursor is formed on at least a portion of the surface. Molecules of the supercritical fluid is removed from the surface. The surface is exposed to plasma radical to transform the layer of the precursor into a solid thin film. In some embodiments, molecules of the precursor chemically bond with molecules of the supercritical fluid in the mixture. The molecules of the supercritical fluid can be decoupled from the molecules of the precursor before the layer of the precursor is formed.

Methods of forming carbon polymer films are disclosed. Some methods are advantageously performed at lower temperatures. The substrate is exposed to a first carbon precursor to form a substrate surface with terminations based on the reactive functional groups of the first carbon precursor and exposed to a second carbon precursor to react with the surface terminations and form a carbon polymer film. Processing tools and non-transitory memories to perform the process are also disclosed.

A system, apparatus and method enable etching of a layer of a substrate with reduced etching on the surface of a side wall of the layer. The etching method includes forming a protective layer on a surface of the side wall defining a recess in the layer. The protective layer contains phosphorus. The etching method further includes etching the layer in one or more additional cycles so as to increase a depth of the recess after the forming the protective layer.

In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink (1) contains a copper oxide (2), a dispersant (3), and a reducing agent. The content of the reducing agent is in the range of formula (1), and the content of the dispersant is in the range of formula (2). (1) 0.00010≤(reducing agent mass/copper oxide mass)≤0.10 (2) 0.0050≤(dispersant mass/copper oxide mass)≤0.30 The reducing agent content promotes the reduction of copper oxide to copper during firing, and promotes the sintering of copper.

The invention relates to self-assembled organosilane coatings for resorbable medical implant devices. The coatings can be prepared from coating compositions containing organosilane and can be applied to metal or metal alloy substrates. Prior to applying the coatings, the surfaces of the substrates can be pretreated. The coatings can be functionalized with a binding compound that is coupled with an active component. The coatings can be selectively removed, e.g., patterned, to expose portions of the uncoated substrate. Selecting different patterns can provide the ability to regulate or control various properties, such as, corrosion and hydrogen generation.

Embodiments relate to surface treating a substrate, spraying precursor onto the substrate using supercritical carrier fluid, and post-treating the substrate sprayed with the precursor to form a layer with nanometer thickness of material on the substrate. A spraying assembly for spraying the precursor includes one or more spraying modules and one or more radical injectors at one or more sides of the spraying module. A differential spread mechanism is provided between the spraying module and the radical injectors to inject spread gas that isolates the sprayed precursor and radicals generated by the radical injectors. As relative movement between the substrate and the spraying assembly is made, portions of the substrate is exposed to first radicals, sprayed with precursors either one of the spraying modules or both spraying modules using supercritical carrier fluid, and then exposed to second radicals again.