The disclosure relates to mechanical support rail cleaners for cleaning support rails of workpiece supports in machine tools, such as in machine tools for thermally cutting workpieces. The cleaners include one or more cleaning member carriers, which carry at least one cleaning member, and a parallel drive, by means of which the cleaning member and the support rail can be moved relative to each other in parallel with a lateral longitudinal face of the support rails and transversely relative to a longitudinal axis of the support rail to remove deposits from the support rail by means of the cleaning member. The support rail cleaner further includes a transverse drive configured to periodically move the one or more cleaning member carriers and the support rail towards and away from each other transversely relative to the lateral longitudinal face of the support rail.

A hole cleaning apparatus includes a member, a brush, and a vacuum source. The brush rotates around a longitudinal axis of the member, or translates in a direction which is substantially parallel to the longitudinal axis of the member. The vacuum source provides vacuum suction within the member.

A pool cleaning device includes a debris collection member having a forward displacement unit connected thereto. The debris collection member includes a generally rectangular-shaped frame having a mesh net suspended therefrom. A pole receiver is positioned along the rear wall of the frame and interacts with a pole to receive a pushing and/or pulling force from a user. The forward displacement unit includes a leading edge member having a plurality of protrusions for disrupting debris located along a pool body. The leading edge member is suspended between a pair of extension arms which also are connected to the frame. A tensioning mechanism is positioned between each arm and the frame and secures the leading edge at a resting location that is above the frame and net.

A surface cleaning device for cleaning surfaces of solar panels, wherein the surface cleaning device may include a main body, at least one extension that extends to at least one side of the main body and comprise at least one extension wheel for interfacing with the solar panels, a first dust carrying member, a second dust carrying member, a motor; and one or more motion delay assemblies; wherein the first dust carrying member and the second dust carrying member are coupled to the motor; wherein the motor is configured to cyclically move the first dust carrying member and the second dust carrying member along a path; wherein the one or more motion delay assemblies are is configured to cyclically introduce a momentarily delay in a progress of the first dust carrying member along the path.

A surface cleaning device for cleaning surfaces of solar panels, wherein the surface cleaning device may include a main body, at least one extension that extends to at least one side of the main body and comprise at least one extension wheel for interfacing with the solar panels, a first dust carrying member, a second dust carrying member, a motor; and one or more motion delay assemblies; wherein the first dust carrying member and the second dust carrying member are coupled to the motor; wherein the motor is configured to cyclically move the first dust carrying member and the second dust carrying member along a path; wherein the one or more motion delay assemblies are is configured to cyclically introduce a momentarily delay in a progress of the first dust carrying member along the path.

A cleaning tool includes a head, a take-up reel, a driven roller, and a passthrough component. The head presses a cleaning element, having a tape shape, onto an optical connector. The take-up reel reels the cleaning element retrieved from the head. The driven roller guides the cleaning element on a convey path from the head to the take-up reel. The pass-through component includes a slit through which the cleaning element is extended, and the pass-through component is located between the driven rollers and the take-up reel.

A substrate cleaning device (31) includes a roll cleaning member (61) and a rotation holding portion (100). The rotation holding portion (100) includes a non-contact sealing portion (140) that is disposed between a bearing portion (130) and the roll cleaning member (61) to seal a gap between a shaft portion (110) and a housing portion (120). The non-contact sealing portion (140) includes a rotating portion (150) that is attached to the shaft portion (110) and has a plurality of protrusion portions (151) formed on a peripheral surface (150a) of the rotating portion (150) at intervals in an axial direction, and a fixed portion (160) that is attached to the housing portion (120), surrounds the plurality of protrusion portions (151), and has a gas supply hole (161) formed in an inner peripheral surface (160a) of the fixed portion (160) surrounding the plurality of protrusion portions (151), the gas supply hole (161) supplying a compressed gas (200) from a position inward of the protrusion portions (151) in the axial direction, which are disposed at both end portions in the axial direction, among the plurality of protrusion portions (151).

A substrate cleaning device (31) includes a roll cleaning member (61) and a rotation holding portion (100). The rotation holding portion (100) includes a non-contact sealing portion (140) that is disposed between a bearing portion (130) and the roll cleaning member (61) to seal a gap between a shaft portion (110) and a housing portion (120). The non-contact sealing portion (140) includes a rotating portion (150) that is attached to the shaft portion (110) and has a plurality of protrusion portions (151) formed on a peripheral surface (150a) of the rotating portion (150) at intervals in an axial direction, and a fixed portion (160) that is attached to the housing portion (120), surrounds the plurality of protrusion portions (151), and has a gas supply hole (161) formed in an inner peripheral surface (160a) of the fixed portion (160) surrounding the plurality of protrusion portions (151), the gas supply hole (161) supplying a compressed gas (200) from a position inward of the protrusion portions (151) in the axial direction, which are disposed at both end portions in the axial direction, among the plurality of protrusion portions (151).

A method of cleaning and polishing a backside surface of a semiconductor wafer is provided. The method includes placing an abrasive brush, comprising an abrasive tape wound around an outer surface of a brush member of the abrasive brush, on the backside surface of the semiconductor wafer. The method also includes rotating the brush member to polish the backside surface of the semiconductor wafer by abrasive grains formed on the abrasive tape and to clean the backside surface of the semiconductor wafer by the brush member which is not covered by the abrasive tape.

A brush for post chemical/mechanical polishing cleaning of a semiconductor wafer is provided, the brush comprising a microporous core with open cell pores and an outer layer of a plurality of loop fibers formed on the outer surface of the microporous core, wherein the brush has a first core flow resistance R1, a second through surface flow resistance R2, and a third flow resistance R3 across the surface and wherein R3<R1<R2.