A method includes performing a first post Chemical Mechanical Polish (CMP) cleaning on a wafer using a first brush. The first brush rotates to clean the wafer. The method further includes performing a second post-CMP cleaning on the wafer using a second brush. The second brush rotates to clean the wafer. The first post-CMP cleaning and the second post-CMP cleaning are performed simultaneously.

The present disclosure relates generally to an apparatus for cleaning or otherwise treating a floor or ground surface. Devices provided herein include various features to enhance the efficiency and efficacy of cleaning operations. Such devices includes, but are not limited to, bearing protector devices, cord and cable management devices, and ergonomic features useful with ride-on floor treating machines.

A substrate processing apparatus includes a processor configured to process a substrate with a processing liquid. The processor has a holder configured to hold the substrate horizontally. The holder includes a first holder configured to come into contact with a center of a bottom surface of the substrate. The processor has a rotation driver configured to rotate the first holder around a vertical rotation axis. The substrate processing apparatus includes a charging member configured to charge a second substrate prepared separately from the substrate; and a controller configured to perform bringing the second substrate charged by the charging member into contact with the first holder.

A substrate processing apparatus includes a processor configured to process a substrate with a processing liquid. The processor has a holder configured to hold the substrate horizontally. The holder includes a first holder configured to come into contact with a center of a bottom surface of the substrate. The processor has a rotation driver configured to rotate the first holder around a vertical rotation axis. The substrate processing apparatus includes a charging member configured to charge a second substrate prepared separately from the substrate; and a controller configured to perform bringing the second substrate charged by the charging member into contact with the first holder.

There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

The present invention relates to a vehicle engine-washing apparatus and a washing method using the washing apparatus, and more particularly, to a vehicle engine-washing engine for washing the inside of vehicle engine, which apparatus includes a hollow operation tube; a guide part having a body inserted into a tip portion of the operation tube and formed with a through-hole, and a leading-in tube formed on the body in such a manner as to communicate with the through-hole; a holder fitted on and fixed to an outer circumferential surface of the operation tube and having a tapered part and an engagement panel formed at an end of the tapered part; an end cap fitted to a terminal end portion of the operation tube and formed with an operation hole; an operation rod inserted through the operation hole of the end cap and having a coupling protrusion formed at one end of the operation rod and a coupling groove formed at the other end; a hollow connection socket disposed in the operation tube, the other end portion of the socket being fitted on the coupling protrusion introduced into the operation tube; and a washing rod having an inserted protrusion formed at one side thereof which is inserted into one end portion of the connection socket, and a brush part provided at the other side, whereby effects are obtained that washing of the inside of the engine is allowed without having to separate the engine, thereby significantly reducing cost and time for maintenance, and anyone can conveniently perform the washing.

A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

A cleaning apparatus includes: a cleaning chamber configured to clean a substrate; a transfer chamber positioned adjacent to the cleaning chamber and configured to transfer the substrate; a partition wall partitioning the cleaning chamber and the transfer chamber; a gutter fixed to the partition wall; and a discharge pipe connected to a bottom portion of the gutter. A first pass hole and a second pass hole positioned below the first pass hole are formed in the partition wall. The gutter is positioned between the first pass hole and the second pass hole, and extends from one side end to the other side end of the partition wall.